IPC j-std-001G Exam with precise detailed solutions
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Terms in this set (46) ||//\\|| ||//\\|| ||//\\|| ||//\\||
Original
Conductor Diameter ||//\\||
the outside diameter of wire,stranded or solid, w/o the insulation
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Wire Diameter ||//\\||
the outside diameter of wire, stranded or solid, with insulation if present
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Disposition
The determination of how defects should be treated.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Electrical Clearance ||//\\||
The minimum spacing between noncommon uninsulated conductors.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
FOD (Foreign Object Debris)
||//\\|| ||//\\|| ||//\\||
A substance, debris, particulate matter or article alien to the assembly or system.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
High Voltage ||//\\||
Varies by design and application. ||//\\|| ||//\\|| ||//\\|| ||//\\||
Manufacturer (Assembler) ||//\\||
Individual, organization, or company responsible for the assembly process and verification
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
operations necessary to ensure full compliance. ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Objective Evidence ||//\\||
Documentation in the form of hard copy, computer data, video, that demonstrates the ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
requirements in the Standard have been met. ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Process Control ||//\\||
A system or method to continually steer an operation in reducing variation in the processes.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Proficiency
, The capability to perform tasks in accordance with the requirements and verification
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
procedures.
Solder Destination Side ||//\\|| ||//\\||
The side of the PCB that the solder flows toward in a plated through-hole application.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Solder Source Side ||//\\|| ||//\\||
The side of the PCB to which solder is applied.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Supplier
The individual, organization or company which provides the Manufacturer components
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
and/or materials. ||//\\||
User
The individual, organization, company, contractually designated authority, or agency
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
responsible for the procurement or design of electrical/electronic hardware, and having the ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
authority to define the class of equipment and any variation or restrictions to the||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
requirements of this Standard. ||//\\|| ||//\\|| ||//\\||
Wire Overwrap ||//\\||
occurs when a wire/lead is wrapped more than 360" and remains in contact with the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
terminal post. ||//\\||
Wire Overlap ||//\\||
occurs when a wire/lead is wrapped more than 360° and crosses over itself, does not remain
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
in contact with the terminal post.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Requirement Flowdown ||//\\||
Standard is contractually required, the applicable requirements of this Standard shall
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
[D1D2D3] be imposed on all applicable subcontracts, assembly drawing(s), documentation ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
and purchase orders. ||//\\|| ||//\\||
Personnel Proficiency ||//\\||
All instructors, operators, and inspection personnel shall [D1D2D3) be proficient in the tasks
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
to be performed. Objective evidence of that proficiency shall [D1D2D3] be maintained and
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
be available for review.
||//\\|| ||//\\|| ||//\\||
Acceptance Requirements ||//\\||
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Terms in this set (46) ||//\\|| ||//\\|| ||//\\|| ||//\\||
Original
Conductor Diameter ||//\\||
the outside diameter of wire,stranded or solid, w/o the insulation
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Wire Diameter ||//\\||
the outside diameter of wire, stranded or solid, with insulation if present
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Disposition
The determination of how defects should be treated.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Electrical Clearance ||//\\||
The minimum spacing between noncommon uninsulated conductors.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
FOD (Foreign Object Debris)
||//\\|| ||//\\|| ||//\\||
A substance, debris, particulate matter or article alien to the assembly or system.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
High Voltage ||//\\||
Varies by design and application. ||//\\|| ||//\\|| ||//\\|| ||//\\||
Manufacturer (Assembler) ||//\\||
Individual, organization, or company responsible for the assembly process and verification
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
operations necessary to ensure full compliance. ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Objective Evidence ||//\\||
Documentation in the form of hard copy, computer data, video, that demonstrates the ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
requirements in the Standard have been met. ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Process Control ||//\\||
A system or method to continually steer an operation in reducing variation in the processes.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Proficiency
, The capability to perform tasks in accordance with the requirements and verification
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
procedures.
Solder Destination Side ||//\\|| ||//\\||
The side of the PCB that the solder flows toward in a plated through-hole application.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Solder Source Side ||//\\|| ||//\\||
The side of the PCB to which solder is applied.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Supplier
The individual, organization or company which provides the Manufacturer components
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
and/or materials. ||//\\||
User
The individual, organization, company, contractually designated authority, or agency
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
responsible for the procurement or design of electrical/electronic hardware, and having the ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
authority to define the class of equipment and any variation or restrictions to the||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
requirements of this Standard. ||//\\|| ||//\\|| ||//\\||
Wire Overwrap ||//\\||
occurs when a wire/lead is wrapped more than 360" and remains in contact with the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
terminal post. ||//\\||
Wire Overlap ||//\\||
occurs when a wire/lead is wrapped more than 360° and crosses over itself, does not remain
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
in contact with the terminal post.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Requirement Flowdown ||//\\||
Standard is contractually required, the applicable requirements of this Standard shall
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
[D1D2D3] be imposed on all applicable subcontracts, assembly drawing(s), documentation ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
and purchase orders. ||//\\|| ||//\\||
Personnel Proficiency ||//\\||
All instructors, operators, and inspection personnel shall [D1D2D3) be proficient in the tasks
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
to be performed. Objective evidence of that proficiency shall [D1D2D3] be maintained and
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
be available for review.
||//\\|| ||//\\|| ||//\\||
Acceptance Requirements ||//\\||
