IPC A 610 TEST BANK QUESTIONS WITH
VERIFIED ANSWERS FULL REVIEW
●● Staking Adhesive - Component Bonding
Defect - Class 3
Answer: Adhesive materials extending from under the component are
visible in the termination area
●● Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3
Answer: - On round components adhesive adheres to a minimum 25% of
the component height
- On round components a minimum of three beads of staking material
placed approximately evenly around the periphery of the component
- Slight flow under the component body does not damage the
components or affect form, fit and function
●● Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3
Answer: On round components there are less than three beads of staking
material
,●● Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3
Answer: Adhesive is not completely cured and homogemous
●● QUESTION**: SMT Leads - Plastic Components
Answer: Unless otherwise specified, solder shall not touch a package
body or seal. Expectations are when a copper lead or termination
configuration causes the solder fillet to contact a plastic component
body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
●● SMT Leads - Damage
Defect - Class 1,2,3
Answer: Lead is damaged or deformed more than 10% of the diameter,
width or thickness of the lead
●● SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3
Answer: The thickness of the flattened lead is less than 40% of the
original diameter
, ●● SMT Connections
Answer: - Components with surface and/or termination ends or sides
that are not wettable by design are exempt from solder wetting
requirements in those areas. Solder fillet wetting to the sides or ends of
the leads is not required unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend
under the body or surface mount components whose leads are made of
Alloy 42 or similar metals.
●● SMT Connections
Acceptable - Class 1,2,3
Answer: Component titled/raised does not affect form, fit or function
●● Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 1,2
Answer: Side overhang (A) is less than or equal to 50% width of
component termination area (W) or 50% width of land (P), whichever is
less
●● Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3
Answer: Side overhang (A) is less than or equal to 25% width of
component termination area (W) or 25% width of land (P), whichever is
less
VERIFIED ANSWERS FULL REVIEW
●● Staking Adhesive - Component Bonding
Defect - Class 3
Answer: Adhesive materials extending from under the component are
visible in the termination area
●● Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3
Answer: - On round components adhesive adheres to a minimum 25% of
the component height
- On round components a minimum of three beads of staking material
placed approximately evenly around the periphery of the component
- Slight flow under the component body does not damage the
components or affect form, fit and function
●● Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3
Answer: On round components there are less than three beads of staking
material
,●● Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3
Answer: Adhesive is not completely cured and homogemous
●● QUESTION**: SMT Leads - Plastic Components
Answer: Unless otherwise specified, solder shall not touch a package
body or seal. Expectations are when a copper lead or termination
configuration causes the solder fillet to contact a plastic component
body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
●● SMT Leads - Damage
Defect - Class 1,2,3
Answer: Lead is damaged or deformed more than 10% of the diameter,
width or thickness of the lead
●● SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3
Answer: The thickness of the flattened lead is less than 40% of the
original diameter
, ●● SMT Connections
Answer: - Components with surface and/or termination ends or sides
that are not wettable by design are exempt from solder wetting
requirements in those areas. Solder fillet wetting to the sides or ends of
the leads is not required unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend
under the body or surface mount components whose leads are made of
Alloy 42 or similar metals.
●● SMT Connections
Acceptable - Class 1,2,3
Answer: Component titled/raised does not affect form, fit or function
●● Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 1,2
Answer: Side overhang (A) is less than or equal to 50% width of
component termination area (W) or 50% width of land (P), whichever is
less
●● Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3
Answer: Side overhang (A) is less than or equal to 25% width of
component termination area (W) or 25% width of land (P), whichever is
less
