IPC J-STD-001G EXAM QUESTIONS
AND ANSWERS
Conductor Diameter - ANSWERSThe conductor diameter is the outside diameter of
wire, either stranded or solid, without the insulation
Wire Diameter - ANSWERShe wire diameter is the outside diameter of wire, either
stranded or solid, including insulation if present
Disposition - ANSWERSThe determination of how defects should be treated.
Dispositions include, but are not limited to, rework, use as is, scrap or repair.
Electrical Clearance - ANSWERSThe minimum spacing between noncommon
uninsulated conductors, e.g., patterns, materials, hardware, residue, is referre<;l to as
"minimum electrical clearance" throughout this document and is defined in the
applicable design standard or on the approved or controlled documentation. In the
absence of a known design standard use Appendix B (derived from IPC-2221).
FOD (Foreign Object Debris) - ANSWERSA generic term for a substance, debris,
particulate matter or article alien to the assembly or system.
High Volatage - ANSWERSThe term "high voltage" will vary by design and application.
The high voltage criteria in this document are only applicable when specifically required
in the drawings/procurement documentation.
Solder Source Side - ANSWERSThe side of the PCB to which solder is applied.
Supplier - ANSWERSThe individual, organization or company which provides the
Manufacturer (assembler) components (electronic, electromechanical, mechanical,
printed boards, etc.) and/or materials (solder, flux, cleaning agents, etc.).
User - ANSWERSThe individual, organization, company, contractually designated
authority, or agency responsible for the procurement or design of electrical/electronic
hardware, and having the authority to define the class of equipment and any variation or
restrictions to the requirements of
this Standard, i.e., the originator/custodian of
the contract detailing these requirements.
Manufacturer (Assembler) - ANSWERSThe individual, organization, or company
responsible for the assembly process and verification operations necessary to ensure
full compliance of assemblies to this Standard.
AND ANSWERS
Conductor Diameter - ANSWERSThe conductor diameter is the outside diameter of
wire, either stranded or solid, without the insulation
Wire Diameter - ANSWERShe wire diameter is the outside diameter of wire, either
stranded or solid, including insulation if present
Disposition - ANSWERSThe determination of how defects should be treated.
Dispositions include, but are not limited to, rework, use as is, scrap or repair.
Electrical Clearance - ANSWERSThe minimum spacing between noncommon
uninsulated conductors, e.g., patterns, materials, hardware, residue, is referre<;l to as
"minimum electrical clearance" throughout this document and is defined in the
applicable design standard or on the approved or controlled documentation. In the
absence of a known design standard use Appendix B (derived from IPC-2221).
FOD (Foreign Object Debris) - ANSWERSA generic term for a substance, debris,
particulate matter or article alien to the assembly or system.
High Volatage - ANSWERSThe term "high voltage" will vary by design and application.
The high voltage criteria in this document are only applicable when specifically required
in the drawings/procurement documentation.
Solder Source Side - ANSWERSThe side of the PCB to which solder is applied.
Supplier - ANSWERSThe individual, organization or company which provides the
Manufacturer (assembler) components (electronic, electromechanical, mechanical,
printed boards, etc.) and/or materials (solder, flux, cleaning agents, etc.).
User - ANSWERSThe individual, organization, company, contractually designated
authority, or agency responsible for the procurement or design of electrical/electronic
hardware, and having the authority to define the class of equipment and any variation or
restrictions to the requirements of
this Standard, i.e., the originator/custodian of
the contract detailing these requirements.
Manufacturer (Assembler) - ANSWERSThe individual, organization, or company
responsible for the assembly process and verification operations necessary to ensure
full compliance of assemblies to this Standard.
