IPC J-STD-001 J SECTION 3 EXAM
QUESTIONS AND ANSWERS
The materials and processes used to assemble/manufacture electronic assemblies
SHALL be selected such that their use, in combination, produce products acceptable to
this standard. - ANSWERS[D1D2D3]
When major elements of the proven processes are changed, e.g., flux, solder paste,
cleaning media or system, solder alloy or soldering system, validation of the
acceptability of the change(s) SHALL be performed and documented, see Appendix B
J-STD-001 Guidance on Objective Evidence of Material Compatibility. -
ANSWERS[N1N2D3]
Manufacturers, when specified, SHALL have a Pb-free control plan (LFCP), which
should be established between the Manufacturer and the User. - ANSWERS[D1D2D3]
The electrical and mechanical integrity of components and assemblies SHALL be
retained after exposure to processes employed during manufacture and assembly, e.g.,
handling, braking, fluxing, soldering and cleaning. - ANSWERS[D1D2D3]
There SHALL be a documented process to control materials, including consumable
materials that are subject to age degradation. - ANSWERS[N1D2D3]
Limited shelf life items SHALL be stored and controlled in accordance with the materials
manufacturer's recommendations or in accordance with the Manufacturer's documented
procedures for controlling shelf life and shelf life extensions. - ANSWERS[N1D2D3]
Unless otherwise specified on the engineering documentation, materials SHALL be
processed (mixing, curing, etc.) per the material specification or other documented
procedure. - ANSWERS[N1D2D3]
Material SHALL be used within the pot life (working time) specified by the material
manufacturer or used within the time period indicated by a documented system. -
ANSWERS[N1D2D3]
When curing conditions (temperature, time, infrared (IR) intensity, etc.) vary from the
material manufacturer's recommended instructions, they SHALL be documented and
available for review. - ANSWERS[N1D2D3]
Items exposed to uncured silicone material SHALL NOT be used for processing other
material. - ANSWERS[D1D2D3]
QUESTIONS AND ANSWERS
The materials and processes used to assemble/manufacture electronic assemblies
SHALL be selected such that their use, in combination, produce products acceptable to
this standard. - ANSWERS[D1D2D3]
When major elements of the proven processes are changed, e.g., flux, solder paste,
cleaning media or system, solder alloy or soldering system, validation of the
acceptability of the change(s) SHALL be performed and documented, see Appendix B
J-STD-001 Guidance on Objective Evidence of Material Compatibility. -
ANSWERS[N1N2D3]
Manufacturers, when specified, SHALL have a Pb-free control plan (LFCP), which
should be established between the Manufacturer and the User. - ANSWERS[D1D2D3]
The electrical and mechanical integrity of components and assemblies SHALL be
retained after exposure to processes employed during manufacture and assembly, e.g.,
handling, braking, fluxing, soldering and cleaning. - ANSWERS[D1D2D3]
There SHALL be a documented process to control materials, including consumable
materials that are subject to age degradation. - ANSWERS[N1D2D3]
Limited shelf life items SHALL be stored and controlled in accordance with the materials
manufacturer's recommendations or in accordance with the Manufacturer's documented
procedures for controlling shelf life and shelf life extensions. - ANSWERS[N1D2D3]
Unless otherwise specified on the engineering documentation, materials SHALL be
processed (mixing, curing, etc.) per the material specification or other documented
procedure. - ANSWERS[N1D2D3]
Material SHALL be used within the pot life (working time) specified by the material
manufacturer or used within the time period indicated by a documented system. -
ANSWERS[N1D2D3]
When curing conditions (temperature, time, infrared (IR) intensity, etc.) vary from the
material manufacturer's recommended instructions, they SHALL be documented and
available for review. - ANSWERS[N1D2D3]
Items exposed to uncured silicone material SHALL NOT be used for processing other
material. - ANSWERS[D1D2D3]
