IPC A 610 COMPREHENSIVE EXAM UPDATED QUESTIONS
AND ANSWERS RATED A+
✔✔Order of Precedence in event of conflict 1 - ✔✔1. Procurement as agreed and
documented between customer and supplier.
✔✔Order of Precedence in event of conflict 2 - ✔✔Master drawing or master ass.
drawing reflecting the customer's detailed requirements.
✔✔Order of Precedence in event of conflict 3 - ✔✔IPC-1-610 when invoked by the
customer or contract.
✔✔If documents other than IPC-A-610 are cited, the order of precedence shall be
defined in the _ - ✔✔Procurement documents
✔✔Target Condition - ✔✔A condition that is close to perfect, but is not always
achievable and may not be necessary to ensure the reliability of the assembly.
✔✔Acceptable Condition - ✔✔A condition that, while not necessarily perfect, will
maintain integrity and reliability of the assembly
✔✔Defect Condition - ✔✔The form, fit or function of the assembly is inadequate for use
in its end use environment.
✔✔A defect for Class 1... - ✔✔automatically implies a defect for Class 2 and 3. A defect
for Class 2 implies a defect for Class 3.
✔✔Disposition - ✔✔The determination of how defects should be treated. These include
rework, use as is, scrap, and repair.
✔✔Who dispositions defect conditions? - ✔✔The manufacturer, based on design,
service and customer requirements.
✔✔Process Indicator Conditions - ✔✔A condition (not a defect) that does not affect the
form, fit or function of a product.
✔✔Process indicators should be... - ✔✔monitored as part of the process control system
✔✔Is disposition of individual process indicators required? - ✔✔No, and affected
products should be used as-is.
✔✔Conditions Not Specified - ✔✔A condition that is neither a defect, nor a process
indicator. A condition not specified may be considered acceptable unless it can be
established that the condition affects user-defined form, fit or function.
, ✔✔Primary Side - ✔✔The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
✔✔The Primary Side is also known as... - ✔✔the component side, or the solder
destination side (in through-hole mounting technology).
✔✔Solder source side - ✔✔The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
✔✔Solder Destination Side - ✔✔The side of the PCB that the solder flows toward in
through-hole technology. The destination is is normally the primary side of the PCB, but
might be the secondary side in some cases.
✔✔Cold Solder Connection - ✔✔A solder connection that exhibits poor wetting and that
is characterized by a grayish porous appearance.
✔✔What can cause a cold solder connection? - ✔✔Excessive impurities in the solder,
inadequate cleaning prior to the soldering, and/or insufficient application of heat during
the soldering process.
✔✔Any violation of minimal electrical clearance is a... - ✔✔defect condition for all
classes.
✔✔Meniscus (component) - ✔✔Sealant or encapsulant on a lead, protruding from the
seating plane of the component. This includes ceramic, epoxy or other composites, and
flash from molded components.
✔✔Nonfunctional Land - ✔✔A land that is not connected electrically to the conductive
pattern on its layer.
✔✔Wire OverWRAP - ✔✔A wire/lead that is wrapped more than 360 degrees and
remains in contact with the terminal post.
✔✔Wire OverLAP - ✔✔A wire/lead is wrapped more than 360 degrees and crosses
over itself (and does not remain in contact with the terminal post).
✔✔Examples and illustrations... - ✔✔are often grossly exaggerated in order to depict
the reasons for this classification.
✔✔Inspection Methodology - ✔✔The inspector does not select the class for the
assembly under inspection.
AND ANSWERS RATED A+
✔✔Order of Precedence in event of conflict 1 - ✔✔1. Procurement as agreed and
documented between customer and supplier.
✔✔Order of Precedence in event of conflict 2 - ✔✔Master drawing or master ass.
drawing reflecting the customer's detailed requirements.
✔✔Order of Precedence in event of conflict 3 - ✔✔IPC-1-610 when invoked by the
customer or contract.
✔✔If documents other than IPC-A-610 are cited, the order of precedence shall be
defined in the _ - ✔✔Procurement documents
✔✔Target Condition - ✔✔A condition that is close to perfect, but is not always
achievable and may not be necessary to ensure the reliability of the assembly.
✔✔Acceptable Condition - ✔✔A condition that, while not necessarily perfect, will
maintain integrity and reliability of the assembly
✔✔Defect Condition - ✔✔The form, fit or function of the assembly is inadequate for use
in its end use environment.
✔✔A defect for Class 1... - ✔✔automatically implies a defect for Class 2 and 3. A defect
for Class 2 implies a defect for Class 3.
✔✔Disposition - ✔✔The determination of how defects should be treated. These include
rework, use as is, scrap, and repair.
✔✔Who dispositions defect conditions? - ✔✔The manufacturer, based on design,
service and customer requirements.
✔✔Process Indicator Conditions - ✔✔A condition (not a defect) that does not affect the
form, fit or function of a product.
✔✔Process indicators should be... - ✔✔monitored as part of the process control system
✔✔Is disposition of individual process indicators required? - ✔✔No, and affected
products should be used as-is.
✔✔Conditions Not Specified - ✔✔A condition that is neither a defect, nor a process
indicator. A condition not specified may be considered acceptable unless it can be
established that the condition affects user-defined form, fit or function.
, ✔✔Primary Side - ✔✔The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
✔✔The Primary Side is also known as... - ✔✔the component side, or the solder
destination side (in through-hole mounting technology).
✔✔Solder source side - ✔✔The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
✔✔Solder Destination Side - ✔✔The side of the PCB that the solder flows toward in
through-hole technology. The destination is is normally the primary side of the PCB, but
might be the secondary side in some cases.
✔✔Cold Solder Connection - ✔✔A solder connection that exhibits poor wetting and that
is characterized by a grayish porous appearance.
✔✔What can cause a cold solder connection? - ✔✔Excessive impurities in the solder,
inadequate cleaning prior to the soldering, and/or insufficient application of heat during
the soldering process.
✔✔Any violation of minimal electrical clearance is a... - ✔✔defect condition for all
classes.
✔✔Meniscus (component) - ✔✔Sealant or encapsulant on a lead, protruding from the
seating plane of the component. This includes ceramic, epoxy or other composites, and
flash from molded components.
✔✔Nonfunctional Land - ✔✔A land that is not connected electrically to the conductive
pattern on its layer.
✔✔Wire OverWRAP - ✔✔A wire/lead that is wrapped more than 360 degrees and
remains in contact with the terminal post.
✔✔Wire OverLAP - ✔✔A wire/lead is wrapped more than 360 degrees and crosses
over itself (and does not remain in contact with the terminal post).
✔✔Examples and illustrations... - ✔✔are often grossly exaggerated in order to depict
the reasons for this classification.
✔✔Inspection Methodology - ✔✔The inspector does not select the class for the
assembly under inspection.
