IPC A 610 LATEST 2026 STUDY GUIDE QUESTIONS AND ANSWERS RATED A+

IPC A 610 LATEST 2026 STUDY GUIDE QUESTIONS AND
ANSWERS RATED A+
✔✔Castellated Terminations - Minimum Fillet Height (F)
Acceptable - Class 3 - ✔✔Minimum fillet height (F) is the solder thickness (G) plus 50%
castellation height (H)

✔✔Flat Gull Wing Leads - Side Overhang (A)
Acceptable - Class 1,2 - ✔✔Maximum overhang (A) is not greater than 50% lead width
(W) or 0.5 mm [0.02 in], whichever is less

✔✔Flat Gull Wing Leads - Side Overhang (A)
Acceptable - Class 3 - ✔✔Maximum overhang (A) is not greater than 25% lead width
(W) or 0.5 mm [0.02 in], whichever is less

✔✔Flat Gull Wing Leads - Toe Overhang (B)
Acceptable - Class 2,3 - ✔✔Formed foot length (L) is greater than three lead widths (W)

✔✔Flat Gull Wing Leads - Minimum End Joint Width (C)
Acceptable - Class 1,2 - ✔✔Minimum end joint width (C) is 50% lead width (W)

✔✔Flat Gull Wing Leads - Minimum End Joint Width (C)
Acceptable - Class 3 - ✔✔Minimum end joint width (C) is 75% lead width (W)

✔✔Flat Gull Wing Leads - Minimum Side Joint Width (D)
Acceptable - Class 2,3 - ✔✔- When foot length (L) is greater than or equal to three lead
widths (W), minimum side joint length (D) is equal to or greater than three lead widths
(W) or 75% (L), whichever is longer
- When foot length (L) is less than three lead widths (W), minimum side joint length (D)
is equal to 100% (L)

✔✔**Flat Gull Wing Leads - Maximum Heel Fillet Height (E)
Acceptable - Class 1,2,3 - ✔✔- Solder touches a plastic SOIC family of components
(small outline packages such as SOT, SOD)
- Solder does not touch ceramic or metal component

✔✔TOE DOWN CONFIGURATION - ✔✔

✔✔Flat Gull Wing Leads - Minimum Heel Fillet Height (E)
Acceptable - Class 2 - ✔✔- Where lead thickness (T) is equal to or less than 0.4 mm
[0.015 in], the minimum heel fillet is solder thickness (G) + lead thickness (T)
- Where lead thickness (T) is greater than 0.4mm [0.015 in], the minimum heel fillet is
solder thickness (G) + 50% lead thickness (T)

, ✔✔Flat Gull Wing Leads - Minimum Heel Fillet Height (E)
Acceptable Class 1,2,3 - ✔✔In the case of a toe-down configuration, the minimum heel
fillet height (F) extends at least to the mid-point of the outside lead bend

✔✔Flat Gull Wing Leads - Coplanarity
Defect - Class 1,2,3 - ✔✔Component lead(s) out of alignment (coplanarity) preventing
the formation of an acceptable solder connection

✔✔TOE DOWN CONFIGURATION (8-65) - ✔✔Mark (8-65)

✔✔Round or Flattened (Coined ) Gull Wing Leads - Minimum Heel Fillet Height (F)
Acceptable - Class 1,2,3 - ✔✔In the case of a toe-down configuration, the minimum
heel fillet height (F) extends at least to the mid-point of the outside lead bend

✔✔Round or Flattened (Coined ) Gull Wing Leads - Minimum Heel Fillet Height (F)
Acceptable - Class 1 - ✔✔A wetted fillet is evident

✔✔Round or Flattened (Coined ) Gull Wing Leads - Minimum Heel Fillet Height (F)
Acceptable - Class 2 - ✔✔Minimum heel fillet height (F) is equal to solder thickness (G)
plus 50% thickness of lead at joint side (T)

✔✔Round or Flattened (Coined ) Gull Wing Leads - Minimum Heel Fillet Height (F)
Acceptable - Class 3 - ✔✔Minimum heel fillet height (F) is equal to solder thickness (G)
plus thickness of lead at joint side (T)

✔✔**J-Leads - Toe Overhang (B)
Acceptable - Class 1,2,3 - ✔✔Toe overhang (B) is an unspecified parameter

✔✔J-Leads - Side Joint Length (D)
Acceptable - Class 2,3 - ✔✔Side joint length (D) greater than or equal to 150% lead
width (W)

✔✔ - ✔✔- Criteria for components
- Criteria for unformed flat lug lead

✔✔Surface Mount Area Array - ✔✔Area array process guidance is provided in IPC-
7095, which contains recommendations, based from extensive discussion of process
development issues

✔✔Surface Mount Area Array - Solder Connections
Acceptable - Class 1,2,3 - ✔✔BGA solder balls contact and wet the land forming a
continuous elliptical round connection