IPC A 610 EXAMINATION 2026 SET QUESTIONS AND
ANSWERS RATED A+
✔✔Cleanliness - Chlorides, Carbonates and White Residues | Defects - Class 1,2,3 -
✔✔Metallic areas exhibit crystalline white deposit
✔✔ - ✔✔- Flux residue does not inhibit visual inspection
- Flux residue does not inhibit access to test points of the assembly
✔✔ - ✔✔Wet, tacky or excessive residues that
✔✔ - ✔✔No-clean flux residue on any electrical
✔✔ - ✔✔Colored residues or rusty appearance on metallic surfaces or hardware
✔✔ - ✔✔Additional information
✔✔ - ✔✔Blisters, scratches, voids that do not expose conductors and do not pridge
adjacent conductors, conductor surfaces or create a hazordous condition which
wouldallow loos
✔✔ - ✔✔Blisters/flaking expose base conductor material
✔✔ - ✔✔- Coating blisters/scratches/voids bridge adjacent non
- Coating blisters/scratches/voids have permitted solder bridges
✔✔Solder Mask Coating - Discoloration | - ✔✔Burned or charred solder mask material
✔✔Conformal Coating - ✔✔Additional information on conformal coating is available in
IPC-CC-830
✔✔ - ✔✔No bridging
- loss of
-
Entrapped material
✔✔ - ✔✔Bridgin of adjacent
-- voids or bubbles
-- wetting or nonwetting
--flaking
discoloration or loss of transparency
✔✔ - ✔✔THin coating is not a target attribute
, ✔✔Elextrical - ✔✔Exposed metal
Note: The thickness requirements of 10.8.3 do not applu
✔✔ - ✔✔Completely cured and uniform
Entrapped foreign material does not violate
Potting Material
Note: Minor surface s
✔✔ - ✔✔Encapsulation material is prent in areas not designated to be encapsulated or
that inteferes wtih the electrical or physical funciton of the assembyl
- Bubbles, blisters, breaks
- Discoloration or loss of transparency
✔✔6-1 - ✔✔soldering connection
✔✔Swaged Hardware - ✔✔Plating and solderability of swaged hardware should be
consistent with appropriate plating and solderability specifications. See IPC/EIA J-STD-
003 for solderability requirements.
✔✔1 - ✔✔
✔✔11 - ✔✔
✔✔111 - ✔✔
✔✔ - ✔✔THe center post is fracutred
✔✔ - ✔✔A post is broken, but sufficient mounting area remains to attach the specified
wires/leads
✔✔ - ✔✔Burnishing and eformation
No more than 3 radialcracks
Any 3 radial splits or cracks are separated by 90°
✔✔ - ✔✔Any circumferential splits or cracks
Any splits or cracks
More than 3 radial splits or cracks
Radial splits or cracks are separated
✔✔ - ✔✔Flared flange solder criteria is provided in 6.1.5
✔✔Swaged Hardware ** - ✔✔Flange Damaged
ANSWERS RATED A+
✔✔Cleanliness - Chlorides, Carbonates and White Residues | Defects - Class 1,2,3 -
✔✔Metallic areas exhibit crystalline white deposit
✔✔ - ✔✔- Flux residue does not inhibit visual inspection
- Flux residue does not inhibit access to test points of the assembly
✔✔ - ✔✔Wet, tacky or excessive residues that
✔✔ - ✔✔No-clean flux residue on any electrical
✔✔ - ✔✔Colored residues or rusty appearance on metallic surfaces or hardware
✔✔ - ✔✔Additional information
✔✔ - ✔✔Blisters, scratches, voids that do not expose conductors and do not pridge
adjacent conductors, conductor surfaces or create a hazordous condition which
wouldallow loos
✔✔ - ✔✔Blisters/flaking expose base conductor material
✔✔ - ✔✔- Coating blisters/scratches/voids bridge adjacent non
- Coating blisters/scratches/voids have permitted solder bridges
✔✔Solder Mask Coating - Discoloration | - ✔✔Burned or charred solder mask material
✔✔Conformal Coating - ✔✔Additional information on conformal coating is available in
IPC-CC-830
✔✔ - ✔✔No bridging
- loss of
-
Entrapped material
✔✔ - ✔✔Bridgin of adjacent
-- voids or bubbles
-- wetting or nonwetting
--flaking
discoloration or loss of transparency
✔✔ - ✔✔THin coating is not a target attribute
, ✔✔Elextrical - ✔✔Exposed metal
Note: The thickness requirements of 10.8.3 do not applu
✔✔ - ✔✔Completely cured and uniform
Entrapped foreign material does not violate
Potting Material
Note: Minor surface s
✔✔ - ✔✔Encapsulation material is prent in areas not designated to be encapsulated or
that inteferes wtih the electrical or physical funciton of the assembyl
- Bubbles, blisters, breaks
- Discoloration or loss of transparency
✔✔6-1 - ✔✔soldering connection
✔✔Swaged Hardware - ✔✔Plating and solderability of swaged hardware should be
consistent with appropriate plating and solderability specifications. See IPC/EIA J-STD-
003 for solderability requirements.
✔✔1 - ✔✔
✔✔11 - ✔✔
✔✔111 - ✔✔
✔✔ - ✔✔THe center post is fracutred
✔✔ - ✔✔A post is broken, but sufficient mounting area remains to attach the specified
wires/leads
✔✔ - ✔✔Burnishing and eformation
No more than 3 radialcracks
Any 3 radial splits or cracks are separated by 90°
✔✔ - ✔✔Any circumferential splits or cracks
Any splits or cracks
More than 3 radial splits or cracks
Radial splits or cracks are separated
✔✔ - ✔✔Flared flange solder criteria is provided in 6.1.5
✔✔Swaged Hardware ** - ✔✔Flange Damaged
