J-STD-001 Exam Questions And Correct Answers 2025/2026 Latest Update (A Pass

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J-STD-001 Exam Questions And Correct
Answers 2025/2026 Latest Update (A Pass)


For heat shrinkable soldering devices wires shall overlap for > 3
conductor diameters for: - ........ANSWERS........[D1D2D3]



The solder shall wet the tinned portion of the wire and should
penetrate to the inner strands of the wire for: -
........ANSWERS........[N1D2D3]



Terminals and solder cups shall not be modified to accept
oversize conductors for: - ........ANSWERS........[A1D2D3]



The rolled or flared area of the flange shall be free of missing
pieces and circumferential splits / cracks for: -
........ANSWERS........[D1D2D3]

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The lead forming process shall not damage lead seals, or welds
for: - ........ANSWERS........[D1D2D3]



Lead terminations in unsupported holes shall be clinched to a
minimum of 45 degrees for: - ........ANSWERS........[N1N2D3]



Tempered leads shall not be terminated with a full-clinch
configuration for: - ........ANSWERS........[D1D2D3]



Solder shall not touch a package body or end seal except for
plastic SOIC family for: - ........ANSWERS........[D1D2D3]



Supporting objective evidence shall include SIR, historical
evidence or electrical testing results for: -
........ANSWERS........[N1D2D3]

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In the absence of a specified cleaning designator, C-22 shall
apply for: - ........ANSWERS........[N1D2D3]



Major changes require validity for: -
........ANSWERS........[N1N2D3], flux, cleaning agents,
geographic change



Minor changes require validity for: -
........ANSWERS........[N1N2D3], changes in cleaning
parameters, etc.



Assemblies shall be free of foreign particles that are loose for: -
........ANSWERS........[D1D2D3]



Assemblies subjected to cleaning processes shall be free of
visible residues for: - ........ANSWERS........[D1D2D3]