As
Component Mounting - Lead Forming - Damage
Defect - Class 1,2,3 Correct Ans-Heavy indentations such as serrated pliers mark
Component Mounting - Leads Crossing Conductors
Acceptable - Class 1,2,3 Correct Ans-- Sleeve does not interfere with formation of the
required solder connection
- Sleeve covers area of protection designated
Component Mounting - Leads Crossing Conductors
Not Established - Class 1
Defect - Class 2,3 Correct Ans-Splitting and/or unraveling of sleeving
Component Mounting - Leads Crossing Conductors
Defect - Class 2,3 Correct Ans-A component lead crossing an electrically noncommon
conductor violates minimum electrical clearance
Component Mounting - Hole Obstruction
Process Indicator - Class 2
Defect - Class 3 Correct Ans-Parts and components obstruct solder flow onto the primary
side (solder destination side) lands of plated through-holes required to be soldered
, IPC-A-610 -Chapter 7 - Through-Hole Technology-Qs &
As
Component Mounting - DIP/SIP Devices and Sockets
Acceptable - Class 1,2,3 Correct Ans-Amount of tilt is limited by minimum lead protrusion
and height requirements
Component Mounting - DIP/SIP Devices and Sockets
Defect - Class 1,2,3 Correct Ans-- Tilt of the component exceeds maximum component
height limits
- Lead protrusion does not meet acceptance requirements due to tilt of component
Component Mounting - Radial Leads - Vertical
Acceptable - Class 1,2,3 Correct Ans-Component tilt does not violate minimum electrical
clearance
Component Mounting - Radial Leads - Vertical - Spacers
Acceptable (Supported Holes) - Class 1,2
Process Indicator (Supported Holes) - Class 3
Defect (Unsupported Holes) - Class 1,2,3 Correct Ans-Spacer is not in full contact with
component and board
Component Mounting - Radial Leads - Vertical - Spacers
Not Established - Class 1
Defect - Class 2,3 Correct Ans-Spacer is inverted
, IPC-A-610 -Chapter 7 - Through-Hole Technology-Qs &
As
Component Mounting - Radial Leads - Horizontal
Acceptable - Class 1,2,3 Correct Ans-Component in contact with board on at least one side
and/or surface
Through-Hole Technology Correct Ans-- The placement of any component on the electronic
assembly does not prevent the insertion or removal of any hardware (tool clearance included)
used to mount the assembly
- Bonding material is sufficient to hold the part but does not encapsulate and cover
component identification
Connection Mounting - Orientation Correct Ans-Inspection usually starts with a general
overall view of the electronic assembly, then follows each component/wire to its connection,
concentrating on the lead into the connection, the connection and the tail end of the
lead/wire leaving the connection. The wire/lead protrusion step for all lands should be saved
for last so that the board can be flipped over and all connections checked together.
*Component Mounting - Orientation - Horizontal
Target - Class 1,2,3 Correct Ans-Nonpolarized components are oriented so that markings
are read the same way (left-to-right or top-to-bottom)
Component Mounting - Orientation - Vertical
Acceptable - Class 1,2,3 Correct Ans-- Polarized part is mounted with a long ground lead