ETA EM5 Comprehensive verified to pass 2024/2025

ETA EM5 ComprehensiveOverheating - correct answer During the soldering process, what is the most common reason for circuit card assembly damage? Apply the iron to both the component lead and pad, paint solder on applicable component lead and pad, and remove iron. - correct answer Which of the following is the proper method to use when soldering a discrete component to a single-sided conductor pad, once flux is applied? Half its exposed length - correct answer When tinning a wire for soldering, how much of the stripped length of a conductor should be tinned? The introduction of dissimilar metals during the solder melt process - correct answer What causes a "fractured solder" joint? 63/37 - correct answer Which tin/lead solder combination has a melting point of 361° F? remove oxidation during soldering. - correct answer Flux is used during the soldering process to: component being soldered - correct answer Heat shunts are used during soldering to prevent damage to the _______________________. Wicking - correct answer When removing solder from a single-sided circuit card assembly, what is the preferred method? Continuous Vacuum - correct answer What is the most effective method of solder removal for a double-sided circuit card assembly? The resistance to current leakage through insulation materials - correct answer What is "insulation resistance"?