IME 156 MIDTERM QUESTIONS AND ANSWERS ALREADY GRADED
A+ LATEST UPDATE
Micro - (ANSWER)In reference to Integrated Circuits (ICs)
Systems - (ANSWER)Electronic products
Packaging - (ANSWER)Electrical connections, mechanical integrity & thermal cooling of ICs and other
components onto PCBs (printed circuit boards)
Packaging Hieracrchy - Lvl 0 - (ANSWER)Wafer level packaging (gate-to-gate interconnection)
Packaging Hieracrchy - Lvl 1 - (ANSWER)Chip level packaging (chip-to-package interconnection)
Packaging Hieracrchy - Lvl 2 - (ANSWER)Board level assembly (packaged chip to PCB board
interconnection)
Packaging Hieracrchy - Lvl 3 - (ANSWER)System level assembly (board-to-board interconnection)
Microsystems Packaging Importance: Cost - (ANSWER)System level packaging tends to drive cost of
products more than IC or PCB packaging does
Microsystems Packaging Importance: Size - (ANSWER)Number of components and their physical size
affects overall product size
Microsystems Packaging Importance: Reliability - (ANSWER)IC Failure tends to be attributed to packaging
rather than electrical circuit defects
Microsystems Packaging Importance: Electrical Performance - (ANSWER)Number of ICs & connections
affects computer processing speed
, IME 156 MIDTERM QUESTIONS AND ANSWERS ALREADY GRADED
A+ LATEST UPDATE
Substrate or base - (ANSWER)-Mechanical support
-Heat dissipation
Fiberglass - (ANSWER)Substrate/Base
-Strong, nonconductive
FR-4 - (ANSWER)Substrate/Base
-Most popular
-FR = Flame Retardant
Conductive or trace - (ANSWER)-electrical connections
-Signal/Power distribution
Copper - (ANSWER)Conductive/Trace
-Light, high conductivity
SSB/DSB - (ANSWER)SSB = Cu on one side
DSB = Cu on both sides
SMOBC (Solder Mask over Bare Copper) - (ANSWER)A plastic coating, typically either Blue or Green
In addition, increases corrosion and flammability resistance and applied for aesthetic reasons.
Ink - (ANSWER)Lettering for component placement, inspection and troubleshooting
-Reference Designators
-Markings for Polarized Components
-Component Values
A+ LATEST UPDATE
Micro - (ANSWER)In reference to Integrated Circuits (ICs)
Systems - (ANSWER)Electronic products
Packaging - (ANSWER)Electrical connections, mechanical integrity & thermal cooling of ICs and other
components onto PCBs (printed circuit boards)
Packaging Hieracrchy - Lvl 0 - (ANSWER)Wafer level packaging (gate-to-gate interconnection)
Packaging Hieracrchy - Lvl 1 - (ANSWER)Chip level packaging (chip-to-package interconnection)
Packaging Hieracrchy - Lvl 2 - (ANSWER)Board level assembly (packaged chip to PCB board
interconnection)
Packaging Hieracrchy - Lvl 3 - (ANSWER)System level assembly (board-to-board interconnection)
Microsystems Packaging Importance: Cost - (ANSWER)System level packaging tends to drive cost of
products more than IC or PCB packaging does
Microsystems Packaging Importance: Size - (ANSWER)Number of components and their physical size
affects overall product size
Microsystems Packaging Importance: Reliability - (ANSWER)IC Failure tends to be attributed to packaging
rather than electrical circuit defects
Microsystems Packaging Importance: Electrical Performance - (ANSWER)Number of ICs & connections
affects computer processing speed
, IME 156 MIDTERM QUESTIONS AND ANSWERS ALREADY GRADED
A+ LATEST UPDATE
Substrate or base - (ANSWER)-Mechanical support
-Heat dissipation
Fiberglass - (ANSWER)Substrate/Base
-Strong, nonconductive
FR-4 - (ANSWER)Substrate/Base
-Most popular
-FR = Flame Retardant
Conductive or trace - (ANSWER)-electrical connections
-Signal/Power distribution
Copper - (ANSWER)Conductive/Trace
-Light, high conductivity
SSB/DSB - (ANSWER)SSB = Cu on one side
DSB = Cu on both sides
SMOBC (Solder Mask over Bare Copper) - (ANSWER)A plastic coating, typically either Blue or Green
In addition, increases corrosion and flammability resistance and applied for aesthetic reasons.
Ink - (ANSWER)Lettering for component placement, inspection and troubleshooting
-Reference Designators
-Markings for Polarized Components
-Component Values
