ATMAE COMPREHENSIVE TEST BANK 2026
VERIFIED QUESTIONS AND SOLUTIONS
100% CORRECT
●● Melting temperature of the filler metals.
Answer: The essential difference between brazing and soldering is the:
●● 0.001 - 0.006 of an inch / 0.025 - 0.15 of a millimeter.
Answer: Joint clearances for both brazing and soldering commonly
range from:
●● Wetting.
Answer: Another term for capillary action is:
●● Dip brazing.
Answer: A brazing process that does not use torches, brazing furnaces or
electric
coils is:
●● Lack of mechanical strength.
Answer: A limitation of the soldering process is:
, ●● Thermoplastics.
Answer: Soldering is not used to join:
●● Exposing only a small area of the board to the solder at any one time.
Answer: In wave soldering excess heat and distortion of the PCB's is
avoided by:
●● 840 °F (450°C)..
Answer: Soldering is done with fillers that melt at below _________ .
●● deformation and diffusion.
Answer: Solid-state processes use ______________________to join
materials without molten and re-solidified material in the final bond
area.
●● joint design.
Answer: Weld process applicability is most dependent upon:
●● becomes part of the weld.
Answer: A consumable electrode is one which:
●● under a blanket of granular flux.
Answer: Submerged arc welding takes place:
VERIFIED QUESTIONS AND SOLUTIONS
100% CORRECT
●● Melting temperature of the filler metals.
Answer: The essential difference between brazing and soldering is the:
●● 0.001 - 0.006 of an inch / 0.025 - 0.15 of a millimeter.
Answer: Joint clearances for both brazing and soldering commonly
range from:
●● Wetting.
Answer: Another term for capillary action is:
●● Dip brazing.
Answer: A brazing process that does not use torches, brazing furnaces or
electric
coils is:
●● Lack of mechanical strength.
Answer: A limitation of the soldering process is:
, ●● Thermoplastics.
Answer: Soldering is not used to join:
●● Exposing only a small area of the board to the solder at any one time.
Answer: In wave soldering excess heat and distortion of the PCB's is
avoided by:
●● 840 °F (450°C)..
Answer: Soldering is done with fillers that melt at below _________ .
●● deformation and diffusion.
Answer: Solid-state processes use ______________________to join
materials without molten and re-solidified material in the final bond
area.
●● joint design.
Answer: Weld process applicability is most dependent upon:
●● becomes part of the weld.
Answer: A consumable electrode is one which:
●● under a blanket of granular flux.
Answer: Submerged arc welding takes place:
