IPC CID Complete Exam 2025 /2026– Detailed Questions & Verified Correct Answers (Graded A+)

IPC CID / COMPLETE EXAM WITH
DETAILED QUESTIONS AND
ANSWERS / GRADED A+



 What do performance classes reflect?
Progressive increases in sophistication, functional performance, and
frequency/intensity of inspection or stress testing
 What are the three kperformance kclasses?
1-General kElectronics k2-Dedicated kService k3-High kreliability
 Who kis kthe kend kuser?
The kend kuser kis kthe kindividual kor kagency kthat kcontracts kthe kprinted
kboard kor kassembly kto kbe kdesigned kand kmanufactured

 Who kdetermines kthe kclass kof ka kproduct?
The kend kuser
 What kwould kbe kin kclass k3 kperformance?
Military, kmedical, ketc.
 What kis kambient ktemperature?
The ksurrounding kenvironment kthat kcomes kinto kcontact kwith kyour
kproduct

 What kdo kproducibility klevels ktell kus?
Increasing kcomplexity kof ktooling, kmaterials, kand kprocessing. kYields
kincrease kas kcosts kdecrease, ketc.

 What kincreases kwith keach kproducibility klevel?
Sophisitication
 What kis kthe kzaxis kaspect kratio?
Ratio kbetween kthe knominal kthickness kof kthe kboard kand kthe ksmallest
kdrill ksize.

 What kis kthe kmost kimportant kspecial kconsideration kin
kterms kof kelectrical kfunctionality kthat ka kdesigner kmust
kconsult kthe kEE? kSpecial kkeep kout kor kkeep kin kareas kof kthe

kboard.

, Where kshould khigh kfrequency kcircuits kbe kplaced?
NEar kthe kconnector
 Where kshould kfiltering kcaps kbe kplaced?
Near kthe ksource kof kpower/gnd k(at kthe kconnector)
 What kis kleast kimportant kto kroute kin kanalog kcircuits?
Power kand kground
 What kis ka kmajor kconsideration kfor kcomponent kplacement?
Will kbackwards kcompatibility kbe knecessary?
 What kis kOhm's klaw?
V=IR
 What kis kan kimportant kbasic krule kfor ka kdesigner kof ka kboard?
Terminate kunused klogic kpins kwith ka kpull-down kor kpull-up kresistor.
 What kproduct ksafety ktesting kregards kflame kretardants?
UL k94
 How kthick kis khalf kounce kcopper?
0.7 kmils k(17 kum kthick)
 What kis kthe ksubtractive kprocess?
Unwanted kcopper kis ketched kaway
 What kis kthe kadditive kprocess?
Only kwanted kcopper kis kadded kto kthe kboard
 What kmust khappen kimmediately kafter kdrilling kthe kholes kin
kthe kboards?
Hole kdeburring
 What kis kan kunsupported khole?
A khole kin kthe kprinted kboard kthat kdoes knot kcontain kplating kor kother
kconductive kreinforcement

 What kis ka ksupported khole?
A khole kthat khas kthe kinside ksurfaces kplated kor kotherwise kreinforced
 What kis ka kburied kvia?
A kvia kthat kextends konly kbetween kconductive klayers kwith kno kexposure
kto kthe koutside kworld

 How kdo kyou kmeasure kannular kring kon kan kexternal klayer?
Including kthe kplating kthe khole.
 How kdo kyou kmeasure kannular kring kon kan kinternal klayer?
Excluding kthe kplating kin kthe khole.
 What kare kminimum kannular kring krequirements kdefined kby?
Internal ksupported, kexternal ksupported kand kexternal kunsupported
kholes.

 What kis kthe kmost kimportant kfactor kin kdetermining kthe kminimum
kland ksize kfor ka khole?
The kmax kdrill khole kdiameter
 What kare keach kof kthe kfollowing: ka+2(b+c)+d

, Min kland ksize=max kdrill khole+2(min kannular
kring+etchback)+manufacturing

 What kis ktolerance?
The kamount kof kvariation kallowed kin ka kdimension kor klocation
 What kis kbreakout?
Drilled khole kbreaking kout kof kthe kedge kof kthe kcopper kland
 What kis kbreakout kacceptability?
Varies kamong kclass, kwhere kdifferent kamounts kof kbreakout kare kallowed.
 What kis kthe kMMC kand kLMC?
Can khave kdimensions kgiven kin ka krange, kwhere kMMC kis kmost kmaterial
kcondition kand kLMC kis kleast kmaterial kcondition

 What kis kthe krecommended kelectrical kspacing kfrom kboard kedge?
16 kmils kPLUS kthe kelectrical krequirement
 What kis kit kcalled kwhen ka kland kis konly kpresent kto
kbalance kthe kconstruction kof kthe kboard?

Nonfunctional klands
 What kis kthe kclearance kon knonfunctional klands?
0.25 kmm k(10 kmils)
 What kis kthermal krelief?
Thermal krelief kis kintended kto kremove ksufficient kcopper kto kavoid
kheatsinking kduring kthe ksoldering kprocesses kwhile kstill kmeeting

kminimum kcurrent kcarrying krequirements

 How kdo kyou kcalculate kthermal kweb ksize?
0.6(1/number kof kwebs)landsize
What kdoes kCTE kstand kfor kand kwhat kare kits kunits?
Coefficient kof kthermal kexpansion kand kppm/C
 What kis kthe kCTE kfor kcopper, kbrass kand kaluminum?
Copper: k17-18 kppm/C; kbrass: k19 kppm/C; kaluminum: k24 kppm/C
 What kis kspecial kabout kthermal kvias?
They kmust kbe kconnected kto kboard-level kplanes
 What kdoes kMTBF kmean?
Mean ktime kbetween kfailures; ka khigher kmean ktime kmeans kyour kboard kis
kmore kreliable

 What kis kthe kdifference kbetween kburn-in ktesting kand kHAST?
HAST kis kusually kdestructive kwhile kburn-in kis knon-destructive kand
kworks kto kfind kinfant kmortality kissues

 What kis ka ktest kcoupon?
Companies kfind kthem kbeneficial kand kincorporate kthem kinto kboard
kproduction kpanels kto knot kwaste ka kgood kboard kin kproduction

 What kis ktrue kof ktest kprobes?
They kmust kmake kcontact kwith kevery knet, kand kcan kbe kensured kwith kthe
ksupplied knet-list