ipc j-std-001G EXAM QUESTIONS WITH
COMPLETE SOLUTIONS
Conductor |Diameter
the |outside |diameter |of |wire,stranded |or |solid, |w/o |the |insulation
Wire |Diameter
the |outside |diameter |of |wire, |stranded |or |solid, |with |insulation |if |present
Disposition
The |determination |of |how |defects |should |be |treated.
Electrical |Clearance
The |minimum |spacing |between |noncommon |uninsulated |conductors.
FOD |(Foreign |Object |Debris)
A |substance, |debris, |particulate |matter |or |article |alien |to |the |assembly |or |system.
High |Voltage
Varies |by |design |and |application.
Manufacturer |(Assembler)
Individual, |organization, |or |company |responsible |for |the |assembly |process |and |verification |
operations |necessary |to |ensure |full |compliance.
Objective |Evidence
Documentation |in |the |form |of |hard |copy, |computer |data, |video, |that |demonstrates |the |
requirements |in |the |Standard |have |been |met.
Process |Control
A |system |or |method |to |continually |steer |an |operation |in |reducing |variation |in |the |processes.
Proficiency
, The |capability |to |perform |tasks |in |accordance |with |the |requirements |and |verification |
procedures.
Solder |Destination |Side
The |side |of |the |PCB |that |the |solder |flows |toward |in |a |plated |through-hole |application.
Solder |Source |Side
The |side |of |the |PCB |to |which |solder |is |applied.
Supplier
The |individual, |organization |or |company |which |provides |the |Manufacturer |components |and/or
|materials.
User
The |individual, |organization, |company, |contractually |designated |authority, |or |agency |
responsible |for |the |procurement |or |design |of |electrical/electronic |hardware, |and |having |the |
authority |to |define |the |class |of |equipment |and |any |variation |or |restrictions |to |the |
requirements |of |this |Standard.
Wire |Overwrap
occurs |when |a |wire/lead |is |wrapped |more |than |360" |and |remains |in |contact |with |the |terminal
|post.
Wire |Overlap
occurs |when |a |wire/lead |is |wrapped |more |than |360° |and |crosses |over |itself, |does |not |remain |
in |contact |with |the |terminal |post.
Requirement |Flowdown
Standard |is |contractually |required, |the |applicable |requirements |of |this |Standard |shall |
[D1D2D3] |be |imposed |on |all |applicable |subcontracts, |assembly |drawing(s), |documentation |and
|purchase |orders.
Personnel |Proficiency
All |instructors, |operators, |and |inspection |personnel |shall |[D1D2D3) |be |proficient |in |the |tasks |
to |be |performed. |Objective |evidence |of |that |proficiency |shall |[D1D2D3] |be |maintained |and |be |
available |for |review.
Acceptance |Requirements
COMPLETE SOLUTIONS
Conductor |Diameter
the |outside |diameter |of |wire,stranded |or |solid, |w/o |the |insulation
Wire |Diameter
the |outside |diameter |of |wire, |stranded |or |solid, |with |insulation |if |present
Disposition
The |determination |of |how |defects |should |be |treated.
Electrical |Clearance
The |minimum |spacing |between |noncommon |uninsulated |conductors.
FOD |(Foreign |Object |Debris)
A |substance, |debris, |particulate |matter |or |article |alien |to |the |assembly |or |system.
High |Voltage
Varies |by |design |and |application.
Manufacturer |(Assembler)
Individual, |organization, |or |company |responsible |for |the |assembly |process |and |verification |
operations |necessary |to |ensure |full |compliance.
Objective |Evidence
Documentation |in |the |form |of |hard |copy, |computer |data, |video, |that |demonstrates |the |
requirements |in |the |Standard |have |been |met.
Process |Control
A |system |or |method |to |continually |steer |an |operation |in |reducing |variation |in |the |processes.
Proficiency
, The |capability |to |perform |tasks |in |accordance |with |the |requirements |and |verification |
procedures.
Solder |Destination |Side
The |side |of |the |PCB |that |the |solder |flows |toward |in |a |plated |through-hole |application.
Solder |Source |Side
The |side |of |the |PCB |to |which |solder |is |applied.
Supplier
The |individual, |organization |or |company |which |provides |the |Manufacturer |components |and/or
|materials.
User
The |individual, |organization, |company, |contractually |designated |authority, |or |agency |
responsible |for |the |procurement |or |design |of |electrical/electronic |hardware, |and |having |the |
authority |to |define |the |class |of |equipment |and |any |variation |or |restrictions |to |the |
requirements |of |this |Standard.
Wire |Overwrap
occurs |when |a |wire/lead |is |wrapped |more |than |360" |and |remains |in |contact |with |the |terminal
|post.
Wire |Overlap
occurs |when |a |wire/lead |is |wrapped |more |than |360° |and |crosses |over |itself, |does |not |remain |
in |contact |with |the |terminal |post.
Requirement |Flowdown
Standard |is |contractually |required, |the |applicable |requirements |of |this |Standard |shall |
[D1D2D3] |be |imposed |on |all |applicable |subcontracts, |assembly |drawing(s), |documentation |and
|purchase |orders.
Personnel |Proficiency
All |instructors, |operators, |and |inspection |personnel |shall |[D1D2D3) |be |proficient |in |the |tasks |
to |be |performed. |Objective |evidence |of |that |proficiency |shall |[D1D2D3] |be |maintained |and |be |
available |for |review.
Acceptance |Requirements
