IPC J-STD-001G questions and answers graded
A+ latest update
1. Conductor Diameter the outside diameter of wire, stranded or solid, w/o the insulation
2. Wire Diameter the outside diameter of wire, stranded or solid, with insulation if
present
3. Disposition The determination of how defects should be treated.
4. Electrical Clearance The minimum spacing between noncommon uninsulated
conductors.
5. FOD (Foreign A substance, debris, particulate matter or article alien to the assembly
Object Debris) or system.
6. High Voltage Varies by design and application.
7. Manufacturer Individual, organization, or company responsible for the assembly
(As- sembler) process and verification operations necessary to ensure full
compliance.
8. Objective Evidence Documentation in the form of hard copy, computer data, video, that
demon-
strates the requirements in the Standard have been met.
9. Process Control A system or method to continually steer an operation in reducing
variation
in the processes.
10. Proficiency The capability to perform tasks in accordance with the requirements
and
verification procedures.
11. Solder The side of the PCB that the solder flows toward in a plated through-
Destination Side hole application.
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9
, IPC J-STD-001G questions and answers graded
A+ latest update
12. Solder Source Side The side of the PCB to which solder is applied.
13. Supplier The individual, organization or company which provides the
Manufacturer
components and/or materials.
14. User The individual, organization, company, contractually designated
authority, or agency responsible for the procurement or design of
electrical/electronic
2/
9
A+ latest update
1. Conductor Diameter the outside diameter of wire, stranded or solid, w/o the insulation
2. Wire Diameter the outside diameter of wire, stranded or solid, with insulation if
present
3. Disposition The determination of how defects should be treated.
4. Electrical Clearance The minimum spacing between noncommon uninsulated
conductors.
5. FOD (Foreign A substance, debris, particulate matter or article alien to the assembly
Object Debris) or system.
6. High Voltage Varies by design and application.
7. Manufacturer Individual, organization, or company responsible for the assembly
(As- sembler) process and verification operations necessary to ensure full
compliance.
8. Objective Evidence Documentation in the form of hard copy, computer data, video, that
demon-
strates the requirements in the Standard have been met.
9. Process Control A system or method to continually steer an operation in reducing
variation
in the processes.
10. Proficiency The capability to perform tasks in accordance with the requirements
and
verification procedures.
11. Solder The side of the PCB that the solder flows toward in a plated through-
Destination Side hole application.
1/
9
, IPC J-STD-001G questions and answers graded
A+ latest update
12. Solder Source Side The side of the PCB to which solder is applied.
13. Supplier The individual, organization or company which provides the
Manufacturer
components and/or materials.
14. User The individual, organization, company, contractually designated
authority, or agency responsible for the procurement or design of
electrical/electronic
2/
9
