IPC A 610 MAIN EXAM TEST 2025/2026 QUESTIONS WITH
ANSWERS GRADED A+
✔✔Component Mounting - Connectors - Right Angle
Defect - Class 1,2,3 - ✔✔Connector spacing affect mating of connector with assembling
requirements, e.g., face plates, bracket, mating connector, etc.
✔✔Defect Class 1 - ✔✔Defect Class 2 and 3 = Defect Class 1
✔✔Component Mounting - Connectors - Vertical Shrouded Pin Headers and Vertical
Receptacle Connectors
Acceptable - Class 2,3 - ✔✔Maximum misalignment between any two modules/pins in
the connector lineup is less than 0.25 mm [0.01 in]
✔✔Component Mounting - Connectors - Vertical Shrouded Pin Headers and Vertical
Receptacle Connectors
Defect - Class 2,3 - ✔✔Connector-to-board spacing is greater than 0.13 mm [0.005 in]
✔✔Component Mounting - Conductive Cases - ✔✔Where a potential for shorting
(violation of minimum electrical clearance) exists between conductive component
bodies, at least one of the bodies shall be protected by an insulator
✔✔Component Securing - Mounting Clips
Acceptable - Class 1,2,3 - ✔✔- The component is mount with the center of gravity within
the confines of the clip
- Spacing between the land and uninsulated component body does not violate minimum
electrical clearance
✔✔Component Securing - Mounting Clips
Defect - Class 1,2,3 - ✔✔Clip does not restrain component
✔✔Component Securing - Adhesive Bonding - ✔✔- The criteria below shall be used
when staking is required and criteria are not provided on the drawing. These criteria do
not apply to SMT components.
- Visual inspection of staking may be performed without magnification. Magnification
from 1.75X to 4X may be used for referee purposes.
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Acceptable - Class 1,2,3 - ✔✔On a horizontally mounted component the staking
material:
- Adheres to component for at least 50% of it's length (L)
- Minimum fillet height of 25% of the component diameter (D)
On a vertically mounted component:
, - The staking material bead(s) are continuous for at least 25% of the component length
(L) (height) with slight flow of staking material under the component body with contact to
the component body seal
- The staking material adheres to the component:
-- For at least three beads spaced approximately evenly around the circumference
adding to minimum 25%
OR
-- A single bead for a minimum of at least 25% of the component circumference
Multiple vertically mounted components:
- Staking material adheres to each component for at least 25% of its length (L), and the
adhesion is continuous between components
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1,2
Defect - Class 3 - ✔✔On a vertically mounted component (sleeved or unsleeved) the
staking material is less than 25% of the component's diameter (D) on both sides
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1
Defect - Class 2,3 - ✔✔Horizontally mounted axial leaded components having staking
material contacting component body seals
Vertically mounted component:
- Adhesive is less than 25% of the component length (height)
✔✔Component Securing - Adhesive Bonding - Elevated Components
Acceptable - Class 1,2,3 - ✔✔- In at least four places evenly spaced
- At least 20% of the total periphery of the component is bonded
- Adhesive material does not interfere with formation of required solder connection
✔✔Component Securing - Adhesive Bonding - Elevated Components
Defect - Class 1,2,3 - ✔✔- Bonding requirements are less than specified requirements
- The bonding material forms too thin a column to provide good support
✔✔Supported Holes - Axial Leaded - Horizontal
Process Indicator - Class 3 - ✔✔The farthest distance (D) between the component body
and the board is larger than 0.7 mm [0.03 in]
✔✔Supported Holes - Axial Leaded - Horizontal
Defect - Class 1,2,3 - ✔✔-Component height exceeds user-determined dimension (H)
- Components required to be mounted above the board surface are less than 1.5 mm
[0.06 in] (C) from the board surface
ANSWERS GRADED A+
✔✔Component Mounting - Connectors - Right Angle
Defect - Class 1,2,3 - ✔✔Connector spacing affect mating of connector with assembling
requirements, e.g., face plates, bracket, mating connector, etc.
✔✔Defect Class 1 - ✔✔Defect Class 2 and 3 = Defect Class 1
✔✔Component Mounting - Connectors - Vertical Shrouded Pin Headers and Vertical
Receptacle Connectors
Acceptable - Class 2,3 - ✔✔Maximum misalignment between any two modules/pins in
the connector lineup is less than 0.25 mm [0.01 in]
✔✔Component Mounting - Connectors - Vertical Shrouded Pin Headers and Vertical
Receptacle Connectors
Defect - Class 2,3 - ✔✔Connector-to-board spacing is greater than 0.13 mm [0.005 in]
✔✔Component Mounting - Conductive Cases - ✔✔Where a potential for shorting
(violation of minimum electrical clearance) exists between conductive component
bodies, at least one of the bodies shall be protected by an insulator
✔✔Component Securing - Mounting Clips
Acceptable - Class 1,2,3 - ✔✔- The component is mount with the center of gravity within
the confines of the clip
- Spacing between the land and uninsulated component body does not violate minimum
electrical clearance
✔✔Component Securing - Mounting Clips
Defect - Class 1,2,3 - ✔✔Clip does not restrain component
✔✔Component Securing - Adhesive Bonding - ✔✔- The criteria below shall be used
when staking is required and criteria are not provided on the drawing. These criteria do
not apply to SMT components.
- Visual inspection of staking may be performed without magnification. Magnification
from 1.75X to 4X may be used for referee purposes.
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Acceptable - Class 1,2,3 - ✔✔On a horizontally mounted component the staking
material:
- Adheres to component for at least 50% of it's length (L)
- Minimum fillet height of 25% of the component diameter (D)
On a vertically mounted component:
, - The staking material bead(s) are continuous for at least 25% of the component length
(L) (height) with slight flow of staking material under the component body with contact to
the component body seal
- The staking material adheres to the component:
-- For at least three beads spaced approximately evenly around the circumference
adding to minimum 25%
OR
-- A single bead for a minimum of at least 25% of the component circumference
Multiple vertically mounted components:
- Staking material adheres to each component for at least 25% of its length (L), and the
adhesion is continuous between components
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1,2
Defect - Class 3 - ✔✔On a vertically mounted component (sleeved or unsleeved) the
staking material is less than 25% of the component's diameter (D) on both sides
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1
Defect - Class 2,3 - ✔✔Horizontally mounted axial leaded components having staking
material contacting component body seals
Vertically mounted component:
- Adhesive is less than 25% of the component length (height)
✔✔Component Securing - Adhesive Bonding - Elevated Components
Acceptable - Class 1,2,3 - ✔✔- In at least four places evenly spaced
- At least 20% of the total periphery of the component is bonded
- Adhesive material does not interfere with formation of required solder connection
✔✔Component Securing - Adhesive Bonding - Elevated Components
Defect - Class 1,2,3 - ✔✔- Bonding requirements are less than specified requirements
- The bonding material forms too thin a column to provide good support
✔✔Supported Holes - Axial Leaded - Horizontal
Process Indicator - Class 3 - ✔✔The farthest distance (D) between the component body
and the board is larger than 0.7 mm [0.03 in]
✔✔Supported Holes - Axial Leaded - Horizontal
Defect - Class 1,2,3 - ✔✔-Component height exceeds user-determined dimension (H)
- Components required to be mounted above the board surface are less than 1.5 mm
[0.06 in] (C) from the board surface
