IPC J-STD-003C
Amendment 1
April 2024
JOINT
INDUSTRY
STANDARD
IPC J-STD-
003C
Solderability
Tests for
Printed Boards
Amendment 1
,The Principles of In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of
Standardization Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should: Standards Should Not:
• Show relationship to Design for Manufacturability • Inhibit innovation
(DFM) and Design for the Environment (DFE) • Increase time-to-market
• Minimize time to market • Keep people out
• Contain simple (simplified) language • Increase cycle time
• Just include spec information • Tell you how to make something
• Focus on end product performance • Contain anything that cannot
• Include a feedback system on use and be defended with data
problems for future improvement
Notice IPC Standards and Publications are designed to serve the public interest through eliminating mis-
understandings between manufacturers and purchasers, facilitating interchangeability and improve-
ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the
proper product for his particular need. Existence of such Standards and Publications shall not in
any respect preclude any member or nonmember of IPC from manufacturing or selling products
not conforming to such Standards and Publication, nor shall the existence of such Standards and
Publications preclude their voluntary use by those other than IPC members, whether the standard
is to be used either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to whether their adop-
tion may involve patents on articles, materials, or processes. By such action, IPC does not assume
any liability to any patent owner, nor do they assume any obligation whatever to parties adopting
the Recommended Standard or Publication. Users are also wholly responsible for protecting them-
selves against all claims of liabilities for patent infringement.
IPC Position It is the position of IPC’s Technical Activities Executive Committee that the use and implementation
Statement on of IPC publications is voluntary and is part of a relationship entered into by customer and supplier.
Specification When an IPC publication is updated and a new revision is published, it is the opinion of the TAEC
Revision Change that the use of the new revision as part of an existing relationship is not automatic unless required
by the contract. The TAEC recommends the use of the latest revision. Adopted October 6, 1998
Why is there Your purchase of this document contributes to the ongoing development of new and updated industry
a charge for standards and publications. Standards allow manufacturers, customers, and suppliers to understand
this document? one another better. Standards allow manufacturers greater efficiencies when they can set up their
processes to meet industry standards, allowing them to offer their customers lower costs.
IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the standards
and publications development process. There are many rounds of drafts sent out for review and
the committees spend hundreds of hours in review and development. IPC’s staff attends and par-
ticipates in committee activities, typesets and circulates document drafts, and follows all necessary
procedures to qualify for ANSI approval.
IPC’s membership dues have been kept low to allow as many companies as possible to participate.
Therefore, the standards and publications revenue is necessary to complement dues revenue. The
price schedule offers a 50% discount to IPC members. If your company buys IPC standards and
publications, why not take advantage of this and the many other benefits of IPC membership as
well? For more information on membership in IPC, please visit www.ipc.org or call 847/597-2872.
Thank you for your continued support.
©Copyright 2014 IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Any
copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and
constitutes infringement under the Copyright Law of the United States.
, April 2014 IPC J-STD-003C - Amendment 1
Solderability Tests for Printed Boards
Global Replacements:
Replace ‘‘circuit board’’ with ‘‘printed board’’
Replace ‘‘vendor’’ with ‘‘supplier’’
Beginning with 1.3:
Replace ‘‘plated-through hole’’ with ‘‘PTH’’
Replace ‘‘plated-through holes’’ with ‘‘PTHs’’
Beginning with 1.3.2:
Replace ‘‘as agreed between user and supplier’’ with ‘‘AABUS’’
1.1 Scope
Replace as follows:
1.1 Scope This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of
printed wiring board surface conductors, attachment lands, and plated-through holes (PTHs). This standard is intended for
use by both user and supplier.
This standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on
wettability. This standard describes procedures or methods to determine the acceptable wettability of a surface finish. Wet-
tability can be affected by handling, finish application, and environmental conditions.
1.4 Classification
Replace ‘‘specification’’ with ‘‘standard’’ in the final paragraph as follows:
This standard relies on input from the 4-14 plating process subcommittee and the 4500 series of printed board surface fin-
ish documents generated in that subcommittee to determine the durability rating potential for each specified finish. This
document and the appropriate 4500 series document should be considered complimentary to one another.
1.5 Test Method Classification
Insert new first paragraph, 2nd sentence as follows:
This standard describes test methods by which the surface conductors, attachment lands, and PTHs may be evaluated for
solderability. Edge Dip, Wave Solder, Surface Mount Simulation, and Wetting Balance testing can be used for both tin-lead
(SnPb) and SAC 305 alloys. Other Pb-free alloys may be used for testing AABUS.
Replace within the last paragraph as follows:
The following tests are considered destructive tests. Tested printed boards should not be used in further production steps.
1
Amendment 1
April 2024
JOINT
INDUSTRY
STANDARD
IPC J-STD-
003C
Solderability
Tests for
Printed Boards
Amendment 1
,The Principles of In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of
Standardization Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should: Standards Should Not:
• Show relationship to Design for Manufacturability • Inhibit innovation
(DFM) and Design for the Environment (DFE) • Increase time-to-market
• Minimize time to market • Keep people out
• Contain simple (simplified) language • Increase cycle time
• Just include spec information • Tell you how to make something
• Focus on end product performance • Contain anything that cannot
• Include a feedback system on use and be defended with data
problems for future improvement
Notice IPC Standards and Publications are designed to serve the public interest through eliminating mis-
understandings between manufacturers and purchasers, facilitating interchangeability and improve-
ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the
proper product for his particular need. Existence of such Standards and Publications shall not in
any respect preclude any member or nonmember of IPC from manufacturing or selling products
not conforming to such Standards and Publication, nor shall the existence of such Standards and
Publications preclude their voluntary use by those other than IPC members, whether the standard
is to be used either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to whether their adop-
tion may involve patents on articles, materials, or processes. By such action, IPC does not assume
any liability to any patent owner, nor do they assume any obligation whatever to parties adopting
the Recommended Standard or Publication. Users are also wholly responsible for protecting them-
selves against all claims of liabilities for patent infringement.
IPC Position It is the position of IPC’s Technical Activities Executive Committee that the use and implementation
Statement on of IPC publications is voluntary and is part of a relationship entered into by customer and supplier.
Specification When an IPC publication is updated and a new revision is published, it is the opinion of the TAEC
Revision Change that the use of the new revision as part of an existing relationship is not automatic unless required
by the contract. The TAEC recommends the use of the latest revision. Adopted October 6, 1998
Why is there Your purchase of this document contributes to the ongoing development of new and updated industry
a charge for standards and publications. Standards allow manufacturers, customers, and suppliers to understand
this document? one another better. Standards allow manufacturers greater efficiencies when they can set up their
processes to meet industry standards, allowing them to offer their customers lower costs.
IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the standards
and publications development process. There are many rounds of drafts sent out for review and
the committees spend hundreds of hours in review and development. IPC’s staff attends and par-
ticipates in committee activities, typesets and circulates document drafts, and follows all necessary
procedures to qualify for ANSI approval.
IPC’s membership dues have been kept low to allow as many companies as possible to participate.
Therefore, the standards and publications revenue is necessary to complement dues revenue. The
price schedule offers a 50% discount to IPC members. If your company buys IPC standards and
publications, why not take advantage of this and the many other benefits of IPC membership as
well? For more information on membership in IPC, please visit www.ipc.org or call 847/597-2872.
Thank you for your continued support.
©Copyright 2014 IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Any
copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and
constitutes infringement under the Copyright Law of the United States.
, April 2014 IPC J-STD-003C - Amendment 1
Solderability Tests for Printed Boards
Global Replacements:
Replace ‘‘circuit board’’ with ‘‘printed board’’
Replace ‘‘vendor’’ with ‘‘supplier’’
Beginning with 1.3:
Replace ‘‘plated-through hole’’ with ‘‘PTH’’
Replace ‘‘plated-through holes’’ with ‘‘PTHs’’
Beginning with 1.3.2:
Replace ‘‘as agreed between user and supplier’’ with ‘‘AABUS’’
1.1 Scope
Replace as follows:
1.1 Scope This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of
printed wiring board surface conductors, attachment lands, and plated-through holes (PTHs). This standard is intended for
use by both user and supplier.
This standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on
wettability. This standard describes procedures or methods to determine the acceptable wettability of a surface finish. Wet-
tability can be affected by handling, finish application, and environmental conditions.
1.4 Classification
Replace ‘‘specification’’ with ‘‘standard’’ in the final paragraph as follows:
This standard relies on input from the 4-14 plating process subcommittee and the 4500 series of printed board surface fin-
ish documents generated in that subcommittee to determine the durability rating potential for each specified finish. This
document and the appropriate 4500 series document should be considered complimentary to one another.
1.5 Test Method Classification
Insert new first paragraph, 2nd sentence as follows:
This standard describes test methods by which the surface conductors, attachment lands, and PTHs may be evaluated for
solderability. Edge Dip, Wave Solder, Surface Mount Simulation, and Wetting Balance testing can be used for both tin-lead
(SnPb) and SAC 305 alloys. Other Pb-free alloys may be used for testing AABUS.
Replace within the last paragraph as follows:
The following tests are considered destructive tests. Tested printed boards should not be used in further production steps.
1
