SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
IPC/ECA J-STD-002C
w/Amendment 1
NOVEMBER 2023
Supersedes J-STD-002C
December 2023
IPC/E
CA J-STD-
002C JOINT
INDUSTRY
STANDARD
Solderability Tests for
Component Leads,
Terminations, Lugs,
Terminals and Wires
®
, SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
IPC/ECA J-STD-002C with Amendment 1
®
Solderability Tests
for Component Leads,
Terminations, Lugs,
Terminals and Wires
A joint standard developed by IPC Component and Wire
Solderability Specification Task Group (5-23b) of the Assembly
and Joining Processes Committee (5-20) and the Electronic
Components, Assemblies and Materials Association (ECA)
Soldering Technology Committee (STC)
October 24, 2008
Users of this publication are encouraged to participate in the
Supersedes:
J-STD-002C - December 2007 development of future revisions.
Amendment 1 - October 2008
J-STD-002B - February 2003 Contact:
J-STD-002A - October 1998
J-STD-002 - April 1992 ECA IPC
2500 Wilson Boulevard 3000 Lakeside Drive, Suite 309S
Arlington, VA 22201 Bannockburn, IL 60015-1249
Phone (703) 907-8024 Phone (847) 615-7100
Fax (703) 875-8908 Fax (847) 615-7105
, SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
November 2008 IPC/ECA J-STD-002C with Amendment 1
Solderability Tests for Component Leads,
Terminations, Lugs, Terminals and Wires
1 SCOPE 1.3.1 Visual Acceptance Criteria Tests
Test A – Solder Bath/Dip and Look Test (Leaded
1.1 Scope This standard prescribes test methods, defect Components and Stranded Wires) Tin/Lead Solder (para-
definitions, acceptance criteria, and illustrations for assess- graph 4.2.1)
ing the solderability of electronic component leads,
terminations, solid wires, stranded wires, lugs, and tabs. Test B – Solder Bath/Dip and Look Test (Leadless
This standard also includes a test method for the Resis- Components) Tin/Lead Solder (paragraph 4.2.2)
tance to Dissolution/Dewetting of Metallization. This Test C – Wrapped Wires Test (Lugs, Tabs, Hooked Leads,
standard is intended for use by both vendor and user. and Turrets) Tin/Lead Solder (paragraph 4.2.3)
Test D – Resistance to Dissolution/Dewetting of Metalli-
1.2 Purpose Solderability evaluations are made to verify
zation Test Tin/Lead Solder and Lead-free Solder (para-
that the solderability of component leads and terminations
graph 4.2.4)
meets the requirements established in this standard and to
determine that storage has had no adverse effect on the Test S – Surface Mount Process Simulation Test Tin/Lead
ability to solder components to an interconnecting sub- Solder (paragraph 4.2.5)
strate. Determination of solderability can be made at the
Test A1 – Solder Bath/Dip and Look Test (Leaded
time of manufacture, at receipt of the components by the
Components and Stranded Wires) Lead-free Solder (para-
user, or just before assembly and soldering.
graph 4.2.6)
The resistance to dissolution of metallization determina-
Test B1 – Solder Bath/Dip and Look Test (Leadless
tion is made to verify that metallized terminations will
Components) Lead-free Solder (paragraph 4.2.7)
remain intact throughout the assembly soldering pro-
cesses. Test C1 – Wrapped Wires Test (Lugs, Tabs, Hooked
Leads, and Turrets) Lead-free Solder (paragraph 4.2.8)
1.2.1 Shall and Should The word “shall” is used in the Test S1 – Surface Mount Process Simulation Test Lead-
text of this document wherever there is a requirement for free Solder (paragraph 4.2.9)
materials, preparation, process control or acceptance of a
soldered connection or a test method. The word “should”
1.3.2 Force Measurement Tests
reflects recommendations and is used to reflect general
industry practices and procedures for guidance only. Test E – Wetting Balance Solder Pot Test (Leaded
Components) Tin/Lead Solder (paragraph 4.3.1)
1.2.2 Document Hierarchy In the event of conflict, the Test F – Wetting Balance Solder Pot Test (Leadless
following decreasing order of precedence applies: Components) Tin/Lead Solder (paragraph 4.3.2)
1. Procurement as agreed between user and supplier. Test G – Wetting Balance Globule Test Tin/Lead Solder
2. Master drawing or master assembly drawing reflecting (paragraph 4.3.3)
the user’s detailed requirements. Test E1 – Wetting Balance Solder Pot Test (Leaded
3. When invoked by the customer or per contractual Components) Lead-free Solder (paragraph 4.3.4)
agreement, this document, J-STD-002.
Test F1 – Wetting Balance Solder Pot Test (Leadless
4. Other documents to extent specified by the customer. Components) Lead-free Solder (paragraph 4.3.5)
Test G1 – Wetting Balance Globule Test Lead-free Solder
1.3 Method Classification This standard describes
(paragraph 4.3.6)
methods by which component leads or terminations may
be evaluated for solderability. Test A, Test B, Test C, Test These methods (1.3.2) are included for evaluation pur-
D and Test S for tin/lead solder processes and Test A1, poses only. Data collected should be submitted to the IPC
Test B1, Test C1, Test D and Test S1 for lead-free solder Wetting Balance Task Group for correlation and analysis.
processes, unless otherwise agreed upon between vendor Tests E, F, G, E1, F1 and G1 shall not be used for
and user, are to be used for each application as a default. acceptance/rejection without user and vendor agreement.
1
, SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
IPC/ECA J-STD-002C with Amendment 1 November 2008
1.4 Coating Durability The following are guidelines, not 1.7 Contractual Agreement In cases where the stated
specification requirements, for determining the needed test parameters are inappropriate or insufficient, alternative
level of steam conditioning category assurance (see Table parameters may be agreed upon between vendor and user.
1–1). The Coating Durability guidelines describe three
broad usage sectors and are not intended to encompass all 2 APPLICABLE DOCUMENTS
possible product use scenarios. The user and vendor need
to agree on the coating durability requirements. Coating The following documents of the issue currently in effect
Durability Category 3 is the default condition for tin- form a part of this standard to the extent specified herein.
based finishes.
2.1 Industry
Category 1 — Minimum Coating Durability Intended for
surfaces that will be soldered within a short period of time
2.1.1 IPC1
(e.g., up to six months) from the time of testing and are
likely to experience a minimum of thermal exposures
before soldering (see 5.6). IPC-T-50 Terms and Definitions
Category 2 — Typical Coating Durability Intended for IPC-TR-464 Accelerated Aging for Solderability Evalua-
surfaces that will be soldered after an extended time from tions and Addendum
the time of testing and which may see limited thermal
exposures before soldering (see 5.6). J-STD-004 Requirements For Soldering Fluxes
Category 3 – Enhanced Coating Durability (default for
J-STD-005 Requirements for Soldering Pastes
tin-based finishes) Intended for surfaces whose solderabil-
ity may become degraded from storage of longer than six
J-STD-006 Requirements for Electronic Grade Solder
months or from multiple thermal exposures (see 5.6).
Alloys and Fluxed and Non-Fluxed Solid Solder for
Table 1–1 Steam Conditioning Categories Electronic Soldering Applications
for Component Leads and Terminations
Category 1 Category 2 Category 3 IPC-TM-650 Test Methods Manual
No Steam 1 Hour ± 5 min. 8 hours ± 15 min.
Conditioning Steam Steam 2.1.2 International Electrotechnical Commission2
Requirements Conditioning Conditioning
1.5 Referee Verification Solder Dip for Tests A, B, C,
IEC 60068–2-69 Environmental testing – Part 2–69: Tests
A1, B1, C1 When the dipped portion of the termination – Test Te: Solderability testing of electronic components
exhibits anomalies such as surface roughness, or dross, or for surface mounting devices (SMD) by the wetting
anomalies that may have been induced by improper solder balance method
dipping, a referee verification solder dip of the suspect
anomaly may be necessary. Upon reinspection, if the 2.2 Government
suspect anomaly has been removed, the anomaly will have
been verified as a non-rejectable cosmetic surface defect. 2.2.1 Federal
If the anomaly persists, regardless of area, it shall be
classified a rejectable solderability defect. This procedure (CID) A-A-59551 Wires, Electrical, Copper (Uninsulated)
may only be used on one component per lot. Continuous
need of Referee Verification Solder Dip procedure is an 3 REQUIREMENTS
indication of either improper testing procedure, examina-
tion interpretation, or of poor component quality.
3.1 Terms and Definitions The definition of terms shall
be in accordance with IPC-T-50. Terms repeated from
1.6 Limitations This standard shall not be construed as
IPC-T-50 are indicated by an asterisk (*).
a production procedure for the pre-tinning of leads and
terminations. Solderability testing of components is con- Dewetting* A condition that results when molten solder
sidered a destructive test and the tested component should coats a surface and then recedes to leave irregularly-
not be used for functional electrical evaluation. Compo- shaped mounds of solder that are separated by areas that
nents after such solderability testing, shall only be used are covered with a thin film of solder and with the basis
with agreement between the user and supplier (AABUS). metal not exposed.
1. www.ipc.org
2. www.iec.ch
2
IPC/ECA J-STD-002C
w/Amendment 1
NOVEMBER 2023
Supersedes J-STD-002C
December 2023
IPC/E
CA J-STD-
002C JOINT
INDUSTRY
STANDARD
Solderability Tests for
Component Leads,
Terminations, Lugs,
Terminals and Wires
®
, SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
IPC/ECA J-STD-002C with Amendment 1
®
Solderability Tests
for Component Leads,
Terminations, Lugs,
Terminals and Wires
A joint standard developed by IPC Component and Wire
Solderability Specification Task Group (5-23b) of the Assembly
and Joining Processes Committee (5-20) and the Electronic
Components, Assemblies and Materials Association (ECA)
Soldering Technology Committee (STC)
October 24, 2008
Users of this publication are encouraged to participate in the
Supersedes:
J-STD-002C - December 2007 development of future revisions.
Amendment 1 - October 2008
J-STD-002B - February 2003 Contact:
J-STD-002A - October 1998
J-STD-002 - April 1992 ECA IPC
2500 Wilson Boulevard 3000 Lakeside Drive, Suite 309S
Arlington, VA 22201 Bannockburn, IL 60015-1249
Phone (703) 907-8024 Phone (847) 615-7100
Fax (703) 875-8908 Fax (847) 615-7105
, SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
November 2008 IPC/ECA J-STD-002C with Amendment 1
Solderability Tests for Component Leads,
Terminations, Lugs, Terminals and Wires
1 SCOPE 1.3.1 Visual Acceptance Criteria Tests
Test A – Solder Bath/Dip and Look Test (Leaded
1.1 Scope This standard prescribes test methods, defect Components and Stranded Wires) Tin/Lead Solder (para-
definitions, acceptance criteria, and illustrations for assess- graph 4.2.1)
ing the solderability of electronic component leads,
terminations, solid wires, stranded wires, lugs, and tabs. Test B – Solder Bath/Dip and Look Test (Leadless
This standard also includes a test method for the Resis- Components) Tin/Lead Solder (paragraph 4.2.2)
tance to Dissolution/Dewetting of Metallization. This Test C – Wrapped Wires Test (Lugs, Tabs, Hooked Leads,
standard is intended for use by both vendor and user. and Turrets) Tin/Lead Solder (paragraph 4.2.3)
Test D – Resistance to Dissolution/Dewetting of Metalli-
1.2 Purpose Solderability evaluations are made to verify
zation Test Tin/Lead Solder and Lead-free Solder (para-
that the solderability of component leads and terminations
graph 4.2.4)
meets the requirements established in this standard and to
determine that storage has had no adverse effect on the Test S – Surface Mount Process Simulation Test Tin/Lead
ability to solder components to an interconnecting sub- Solder (paragraph 4.2.5)
strate. Determination of solderability can be made at the
Test A1 – Solder Bath/Dip and Look Test (Leaded
time of manufacture, at receipt of the components by the
Components and Stranded Wires) Lead-free Solder (para-
user, or just before assembly and soldering.
graph 4.2.6)
The resistance to dissolution of metallization determina-
Test B1 – Solder Bath/Dip and Look Test (Leadless
tion is made to verify that metallized terminations will
Components) Lead-free Solder (paragraph 4.2.7)
remain intact throughout the assembly soldering pro-
cesses. Test C1 – Wrapped Wires Test (Lugs, Tabs, Hooked
Leads, and Turrets) Lead-free Solder (paragraph 4.2.8)
1.2.1 Shall and Should The word “shall” is used in the Test S1 – Surface Mount Process Simulation Test Lead-
text of this document wherever there is a requirement for free Solder (paragraph 4.2.9)
materials, preparation, process control or acceptance of a
soldered connection or a test method. The word “should”
1.3.2 Force Measurement Tests
reflects recommendations and is used to reflect general
industry practices and procedures for guidance only. Test E – Wetting Balance Solder Pot Test (Leaded
Components) Tin/Lead Solder (paragraph 4.3.1)
1.2.2 Document Hierarchy In the event of conflict, the Test F – Wetting Balance Solder Pot Test (Leadless
following decreasing order of precedence applies: Components) Tin/Lead Solder (paragraph 4.3.2)
1. Procurement as agreed between user and supplier. Test G – Wetting Balance Globule Test Tin/Lead Solder
2. Master drawing or master assembly drawing reflecting (paragraph 4.3.3)
the user’s detailed requirements. Test E1 – Wetting Balance Solder Pot Test (Leaded
3. When invoked by the customer or per contractual Components) Lead-free Solder (paragraph 4.3.4)
agreement, this document, J-STD-002.
Test F1 – Wetting Balance Solder Pot Test (Leadless
4. Other documents to extent specified by the customer. Components) Lead-free Solder (paragraph 4.3.5)
Test G1 – Wetting Balance Globule Test Lead-free Solder
1.3 Method Classification This standard describes
(paragraph 4.3.6)
methods by which component leads or terminations may
be evaluated for solderability. Test A, Test B, Test C, Test These methods (1.3.2) are included for evaluation pur-
D and Test S for tin/lead solder processes and Test A1, poses only. Data collected should be submitted to the IPC
Test B1, Test C1, Test D and Test S1 for lead-free solder Wetting Balance Task Group for correlation and analysis.
processes, unless otherwise agreed upon between vendor Tests E, F, G, E1, F1 and G1 shall not be used for
and user, are to be used for each application as a default. acceptance/rejection without user and vendor agreement.
1
, SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
IPC/ECA J-STD-002C with Amendment 1 November 2008
1.4 Coating Durability The following are guidelines, not 1.7 Contractual Agreement In cases where the stated
specification requirements, for determining the needed test parameters are inappropriate or insufficient, alternative
level of steam conditioning category assurance (see Table parameters may be agreed upon between vendor and user.
1–1). The Coating Durability guidelines describe three
broad usage sectors and are not intended to encompass all 2 APPLICABLE DOCUMENTS
possible product use scenarios. The user and vendor need
to agree on the coating durability requirements. Coating The following documents of the issue currently in effect
Durability Category 3 is the default condition for tin- form a part of this standard to the extent specified herein.
based finishes.
2.1 Industry
Category 1 — Minimum Coating Durability Intended for
surfaces that will be soldered within a short period of time
2.1.1 IPC1
(e.g., up to six months) from the time of testing and are
likely to experience a minimum of thermal exposures
before soldering (see 5.6). IPC-T-50 Terms and Definitions
Category 2 — Typical Coating Durability Intended for IPC-TR-464 Accelerated Aging for Solderability Evalua-
surfaces that will be soldered after an extended time from tions and Addendum
the time of testing and which may see limited thermal
exposures before soldering (see 5.6). J-STD-004 Requirements For Soldering Fluxes
Category 3 – Enhanced Coating Durability (default for
J-STD-005 Requirements for Soldering Pastes
tin-based finishes) Intended for surfaces whose solderabil-
ity may become degraded from storage of longer than six
J-STD-006 Requirements for Electronic Grade Solder
months or from multiple thermal exposures (see 5.6).
Alloys and Fluxed and Non-Fluxed Solid Solder for
Table 1–1 Steam Conditioning Categories Electronic Soldering Applications
for Component Leads and Terminations
Category 1 Category 2 Category 3 IPC-TM-650 Test Methods Manual
No Steam 1 Hour ± 5 min. 8 hours ± 15 min.
Conditioning Steam Steam 2.1.2 International Electrotechnical Commission2
Requirements Conditioning Conditioning
1.5 Referee Verification Solder Dip for Tests A, B, C,
IEC 60068–2-69 Environmental testing – Part 2–69: Tests
A1, B1, C1 When the dipped portion of the termination – Test Te: Solderability testing of electronic components
exhibits anomalies such as surface roughness, or dross, or for surface mounting devices (SMD) by the wetting
anomalies that may have been induced by improper solder balance method
dipping, a referee verification solder dip of the suspect
anomaly may be necessary. Upon reinspection, if the 2.2 Government
suspect anomaly has been removed, the anomaly will have
been verified as a non-rejectable cosmetic surface defect. 2.2.1 Federal
If the anomaly persists, regardless of area, it shall be
classified a rejectable solderability defect. This procedure (CID) A-A-59551 Wires, Electrical, Copper (Uninsulated)
may only be used on one component per lot. Continuous
need of Referee Verification Solder Dip procedure is an 3 REQUIREMENTS
indication of either improper testing procedure, examina-
tion interpretation, or of poor component quality.
3.1 Terms and Definitions The definition of terms shall
be in accordance with IPC-T-50. Terms repeated from
1.6 Limitations This standard shall not be construed as
IPC-T-50 are indicated by an asterisk (*).
a production procedure for the pre-tinning of leads and
terminations. Solderability testing of components is con- Dewetting* A condition that results when molten solder
sidered a destructive test and the tested component should coats a surface and then recedes to leave irregularly-
not be used for functional electrical evaluation. Compo- shaped mounds of solder that are separated by areas that
nents after such solderability testing, shall only be used are covered with a thin film of solder and with the basis
with agreement between the user and supplier (AABUS). metal not exposed.
1. www.ipc.org
2. www.iec.ch
2
