IPC J-STD-001G EXAM WITH CORRECT ANSWERS
1.Conductor Diameter: the outside diameter of wire,stranded or solid,
w/o the insulation
2.Wire Diameter: the outside diameter of wire, stranded or solid, with
insulation if present
3.Disposition: The determination of how defects should be treated.
4.Electrical Clearance: The minimum spacing between noncommon
uninsulated conductors.
5.FOD (Foreign Object Debris): A substance, debris, particulate matter or
article alien to the assembly or system.
6.High Voltage: Varies by design and application.
7.Manufacturer (Assembler): Individual, organization, or company
responsible for the assembly process and verification operations
necessary to ensure full compli- ance.
8.Objective Evidence: Documentation in the form of hard copy,
computer data, video, that demonstrates the requirements in the
Standard have been met.
9.Process Control: A system or method to continually steer an operation
in reduc- ing variation in the processes.
10.Proficiency: The capability to perform tasks in accordance with the
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, require- ments and verification procedures.
11.Solder Destination Side: The side of the PCB that the solder flows
toward in a plated through-hole application.
12.Solder Source Side: The side of the PCB to which solder is applied.
13.Supplier: The individual, organization or company which provides the
Manufac- turer components and/or materials.
14.User: The individual, organization, company, contractually designated
authority, or agency responsible for the procurement or design of
electrical/electronic hard- ware, and having the authority to define the
class of equipment and any variation or restrictions to the requirements
of this Standard.
15.Wire Overwrap: occurs when a wire/lead is wrapped more than
360" and remains in contact with the terminal post.
16.Wire Overlap: occurs when a wire/lead is wrapped more than 360°
and crosses over itself, does not remain in contact with the terminal
post.
17.Requirement Flowdown: Standard is contractually required, the
applicable requirements of this Standard shall [D1D2D3] be imposed on
all applicable subcon- tracts, assembly drawing(s), documentation and
purchase orders.
18.Personnel Proficiency: All instructors, operators, and inspection
personnel shall [D1D2D3) be proficient in the tasks to be performed.
Objective evidence of that proficiency shall [D1D2D3] be maintained
and be available for review.
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1.Conductor Diameter: the outside diameter of wire,stranded or solid,
w/o the insulation
2.Wire Diameter: the outside diameter of wire, stranded or solid, with
insulation if present
3.Disposition: The determination of how defects should be treated.
4.Electrical Clearance: The minimum spacing between noncommon
uninsulated conductors.
5.FOD (Foreign Object Debris): A substance, debris, particulate matter or
article alien to the assembly or system.
6.High Voltage: Varies by design and application.
7.Manufacturer (Assembler): Individual, organization, or company
responsible for the assembly process and verification operations
necessary to ensure full compli- ance.
8.Objective Evidence: Documentation in the form of hard copy,
computer data, video, that demonstrates the requirements in the
Standard have been met.
9.Process Control: A system or method to continually steer an operation
in reduc- ing variation in the processes.
10.Proficiency: The capability to perform tasks in accordance with the
1/
5
, require- ments and verification procedures.
11.Solder Destination Side: The side of the PCB that the solder flows
toward in a plated through-hole application.
12.Solder Source Side: The side of the PCB to which solder is applied.
13.Supplier: The individual, organization or company which provides the
Manufac- turer components and/or materials.
14.User: The individual, organization, company, contractually designated
authority, or agency responsible for the procurement or design of
electrical/electronic hard- ware, and having the authority to define the
class of equipment and any variation or restrictions to the requirements
of this Standard.
15.Wire Overwrap: occurs when a wire/lead is wrapped more than
360" and remains in contact with the terminal post.
16.Wire Overlap: occurs when a wire/lead is wrapped more than 360°
and crosses over itself, does not remain in contact with the terminal
post.
17.Requirement Flowdown: Standard is contractually required, the
applicable requirements of this Standard shall [D1D2D3] be imposed on
all applicable subcon- tracts, assembly drawing(s), documentation and
purchase orders.
18.Personnel Proficiency: All instructors, operators, and inspection
personnel shall [D1D2D3) be proficient in the tasks to be performed.
Objective evidence of that proficiency shall [D1D2D3] be maintained
and be available for review.
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