IPC CID+ EXAM |LATEST UPDATED 2026/2027 A
COMPLETE SOLUTION ALL ANSWERS GET IT 100%
CORRECT VERIFIED BEST GRADED A+ FOR SUCCESS
The board material has significant influence on the electrical
performance of the circuit from what two effects?
dielectric constant and the loss tangent
Printed board image/patterns plus the additional contiguous deliverable
material from the panel (+ tabs, fiducials, tooling holes, etc...)
Assembly Array
What is the most common size panel?
18x24in, 460x610mm
Stencil manufacturer work to what location/
Nominal positioning location between two-dimensional variations
What should the designer consider adding to help the stencil
manufacturers?
Alignment fiducials
What ratio should you never go beyond in terms of the length-to-width
ratio?
12:!
How do long, thin boards jeopardize conductor routability?
Routing is primarily on the longitudinal axis and may cause crosstalk and
signal integrity problems
What is the benefit of copper balancing?
Uniform exposure to the etching solutions
,Addition areas of copper foil intended to draw copper in the plating bath
away from the fine conductor images; uniform plating distribution
Plating Thief
What important effect is reduced as an output from copper balancing
from the center to either side in the laminated product
Bow and Twist
What can help straighten a board that does not have proper copper
balance from bow and twist?
Mechanical features like heat sinks and stiffeners
What thermal management technique transfers the heat down to a cooler
plan/surface?
Thermal vias
Thermal energy/heat that is transferred by electro-magnetic radiation
primarily in the infrared (IR) wave length
Radiation
How do large cores/large copper affect the reflow profile?
Significant heatsink and impact the reflow of the solder surfaces
What is highly advisable to do when a board contains a metal core?
Add a note on the Assembly Drawing
Why does 0402 equate to 0.03936~" x 0.01968~" not 0.04"x0.02"?
Inaccurate round offs
What are the 3 vantage points of dimensioning?
Mechanical Constraints Drawing (mating the PCB with the mechanical
housing), PCB Master Drawing, QA inspection criteria (ensure
conformance of manufactured product for intended usage)
, For the relationship of the PCB to the Mechanical Constraints drawing,
what is critical to do to alleviate problems related to tolerance stackup?
Using similar origins and coordinates, 0/0 origin (non-plated tooling hole)
Unusual shaped boards are placed in an assembly array to do what?
Maximize material usage and to facilitate board/array handling
The first two tooling features form the basis for what? The third tooling
features is a method for what?
Dimensioning system; determining any angular movement of a material
Slots with a pin to allow for movement about the center without stressing
any materials
Tooling features
Pros and cons of buried and blind vias?
Cons: Add additional processing steps in manufacturing
Pros: Provide additional real estate for placement and routing
How does the sequential lamination of preparing blind and buried vias
affect the PCB?
Addition in plating thickness
When blind and buried vias are prepared prior to lamination, they should
be considered as what kind of feature?
Through-hole plate feature
When blind and buried vias are prepared after lamination, the drilling
step required what?
Controlled depth
Drill goes down only to the layers that are to be connected and does not
pierce conductors or violate minimum clearance
Controlled depth
COMPLETE SOLUTION ALL ANSWERS GET IT 100%
CORRECT VERIFIED BEST GRADED A+ FOR SUCCESS
The board material has significant influence on the electrical
performance of the circuit from what two effects?
dielectric constant and the loss tangent
Printed board image/patterns plus the additional contiguous deliverable
material from the panel (+ tabs, fiducials, tooling holes, etc...)
Assembly Array
What is the most common size panel?
18x24in, 460x610mm
Stencil manufacturer work to what location/
Nominal positioning location between two-dimensional variations
What should the designer consider adding to help the stencil
manufacturers?
Alignment fiducials
What ratio should you never go beyond in terms of the length-to-width
ratio?
12:!
How do long, thin boards jeopardize conductor routability?
Routing is primarily on the longitudinal axis and may cause crosstalk and
signal integrity problems
What is the benefit of copper balancing?
Uniform exposure to the etching solutions
,Addition areas of copper foil intended to draw copper in the plating bath
away from the fine conductor images; uniform plating distribution
Plating Thief
What important effect is reduced as an output from copper balancing
from the center to either side in the laminated product
Bow and Twist
What can help straighten a board that does not have proper copper
balance from bow and twist?
Mechanical features like heat sinks and stiffeners
What thermal management technique transfers the heat down to a cooler
plan/surface?
Thermal vias
Thermal energy/heat that is transferred by electro-magnetic radiation
primarily in the infrared (IR) wave length
Radiation
How do large cores/large copper affect the reflow profile?
Significant heatsink and impact the reflow of the solder surfaces
What is highly advisable to do when a board contains a metal core?
Add a note on the Assembly Drawing
Why does 0402 equate to 0.03936~" x 0.01968~" not 0.04"x0.02"?
Inaccurate round offs
What are the 3 vantage points of dimensioning?
Mechanical Constraints Drawing (mating the PCB with the mechanical
housing), PCB Master Drawing, QA inspection criteria (ensure
conformance of manufactured product for intended usage)
, For the relationship of the PCB to the Mechanical Constraints drawing,
what is critical to do to alleviate problems related to tolerance stackup?
Using similar origins and coordinates, 0/0 origin (non-plated tooling hole)
Unusual shaped boards are placed in an assembly array to do what?
Maximize material usage and to facilitate board/array handling
The first two tooling features form the basis for what? The third tooling
features is a method for what?
Dimensioning system; determining any angular movement of a material
Slots with a pin to allow for movement about the center without stressing
any materials
Tooling features
Pros and cons of buried and blind vias?
Cons: Add additional processing steps in manufacturing
Pros: Provide additional real estate for placement and routing
How does the sequential lamination of preparing blind and buried vias
affect the PCB?
Addition in plating thickness
When blind and buried vias are prepared prior to lamination, they should
be considered as what kind of feature?
Through-hole plate feature
When blind and buried vias are prepared after lamination, the drilling
step required what?
Controlled depth
Drill goes down only to the layers that are to be connected and does not
pierce conductors or violate minimum clearance
Controlled depth
