IPC-A-610 | Chapter 8 || with Errorless Answers.
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 correct answers Adhesive material extending from under the
component is visible in the termination area, but end joint width meets minimum requirements
Staking Adhesive - Component Bonding
Defect - Class 3 correct answers Adhesive materials extending from under the component are
visible in the termination area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 correct answers - On round components adhesive adheres to a minimum
25% of the component height
- On round components a minimum of three beads of staking material placed approximately
evenly around the periphery of the component
- Slight flow under the component body does not damage the components or affect form, fit and
function
Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 correct answers On round components there are less than three beads of
staking material
Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3 correct answers Adhesive is not completely cured and homogemous
QUESTION**: SMT Leads - Plastic Components correct answers Unless otherwise specified,
solder shall not touch a package body or seal. Expectations are when a copper lead or
termination configuration causes the solder fillet to contact a plastic component body, such as:
, - Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
Defect - Class 1,2,3 correct answers Lead is damaged or deformed more than 10% of the
diameter, width or thickness of the lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 correct answers The thickness of the flattened lead is less than 40% of the
original diameter
SMT Connections correct answers - Components with surface and/or termination ends or sides
that are not wettable by design are exempt from solder wetting requirements in those areas.
Solder fillet wetting to the sides or ends of the leads is not required unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend under the body or
surface mount components whose leads are made of Alloy 42 or similar metals.
SMT Connections
Acceptable - Class 1,2,3 correct answers Component titled/raised does not affect form, fit or
function
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 1,2 correct answers Side overhang (A) is less than or equal to 50% width of
component termination area (W) or 50% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3 correct answers Side overhang (A) is less than or equal to 25% width of
component termination area (W) or 25% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 correct answers Adhesive material extending from under the
component is visible in the termination area, but end joint width meets minimum requirements
Staking Adhesive - Component Bonding
Defect - Class 3 correct answers Adhesive materials extending from under the component are
visible in the termination area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 correct answers - On round components adhesive adheres to a minimum
25% of the component height
- On round components a minimum of three beads of staking material placed approximately
evenly around the periphery of the component
- Slight flow under the component body does not damage the components or affect form, fit and
function
Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 correct answers On round components there are less than three beads of
staking material
Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3 correct answers Adhesive is not completely cured and homogemous
QUESTION**: SMT Leads - Plastic Components correct answers Unless otherwise specified,
solder shall not touch a package body or seal. Expectations are when a copper lead or
termination configuration causes the solder fillet to contact a plastic component body, such as:
, - Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
Defect - Class 1,2,3 correct answers Lead is damaged or deformed more than 10% of the
diameter, width or thickness of the lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 correct answers The thickness of the flattened lead is less than 40% of the
original diameter
SMT Connections correct answers - Components with surface and/or termination ends or sides
that are not wettable by design are exempt from solder wetting requirements in those areas.
Solder fillet wetting to the sides or ends of the leads is not required unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend under the body or
surface mount components whose leads are made of Alloy 42 or similar metals.
SMT Connections
Acceptable - Class 1,2,3 correct answers Component titled/raised does not affect form, fit or
function
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 1,2 correct answers Side overhang (A) is less than or equal to 50% width of
component termination area (W) or 50% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3 correct answers Side overhang (A) is less than or equal to 25% width of
component termination area (W) or 25% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
