Solder Study Guide Exam with All Needed to Pass –
Complete Hand Soldering and PCB Assembly Reference
Introduction:
This document is a comprehensive soldering study guide and exam
preparation resource covering all essential concepts, techniques, and
standards required to pass professional soldering assessments. It
includes detailed questions and correct answers on topics such as
solder joint criteria, flux functions, ESD safety, IPC J-STD-001 Class
3 standards, component orientation and polarity, soldering defects,
and lead/trimming requirements. It also explains critical concepts
like wetting, stress relief, measling, oxidation, and Foreign Object
Debris (FOD) control. Ideal for technicians and engineers preparing
for solder certification exams or improving PCB assembly skills.
Exam Questions and Answers
What is the criteria for cutting leads after soldering? --- correct
precise answer ---When lead cutting is performed after soldering,
the solder connection must be reflowed or visually inspected at 10x
magnification to ensure that the original solder connection has not
been damaged or deformed.
Lead trimming after soldering that cuts into solder fillets SHALL be
reflowed.
What are the requirements for nicks in component leads? ---
correct precise answer ---Components SHALL NOT be mounted if
,the component lead has nicks or deformation exceeding 10% of the
lead diameter, width, or thickness
What does it mean when a component has orientation? --- correct
precise answer ---The component must be installed on the board a
specific way. The print/process instructions identify the proper way
to mount the component along with the physical characteristic that
indicates the component orientation (examples: notch, dimple,
wedge).
What does it mean when a component has polarity? --- correct
precise answer ---Components with a specific positive and negative
connection on the board have polarity. Each component has a
specific function, components with polarity must be mounted on the
board correctly
(examples: band, tab, +).
What is the requirement for vertical fill of solder on PWB plated
through holes? --- correct precise answer ---The requirement for
VERTICAL FILL OF SOLDER on a FWB PLATED THROUGH HOLE IS
75% TOTAL FILL. The 25% unfilled height includes depressions on
the top and bottom of the board.
What are some examples of Foreign Object Debris (FOD) that could
be found within an assembly? ( an all above answer) --- correct
precise answer ---(but are not limited to):
, - dirt
- lint
- solder splashes
- solder dross (debris from solder)
- wire clippings
- flux residue
- solder balls that could be dislodged in the normal service
environment (become loose)
Foreign Object Elimination (FOE) --- correct precise answer ---IS A
PLANNED EFFORT TO ELIMINATE FOREIGN OBJECTS, & prevent
migration of foreign objects into FOD sensitive hardware and
processes
- Avoid touching the board surface with bare hands or fingers
- Boards should be handled by the edges
- Check process instructions for glove/finger cot requirements
before handling boards & assemblies. When gloves/finger cots are
used, change as frequently as necessary to prevent cross
contamination.
What is measling? --- correct precise answer ---Measling appears
on the board surface as discrete white spots or "crosses" below the
surface of the base material.
Complete Hand Soldering and PCB Assembly Reference
Introduction:
This document is a comprehensive soldering study guide and exam
preparation resource covering all essential concepts, techniques, and
standards required to pass professional soldering assessments. It
includes detailed questions and correct answers on topics such as
solder joint criteria, flux functions, ESD safety, IPC J-STD-001 Class
3 standards, component orientation and polarity, soldering defects,
and lead/trimming requirements. It also explains critical concepts
like wetting, stress relief, measling, oxidation, and Foreign Object
Debris (FOD) control. Ideal for technicians and engineers preparing
for solder certification exams or improving PCB assembly skills.
Exam Questions and Answers
What is the criteria for cutting leads after soldering? --- correct
precise answer ---When lead cutting is performed after soldering,
the solder connection must be reflowed or visually inspected at 10x
magnification to ensure that the original solder connection has not
been damaged or deformed.
Lead trimming after soldering that cuts into solder fillets SHALL be
reflowed.
What are the requirements for nicks in component leads? ---
correct precise answer ---Components SHALL NOT be mounted if
,the component lead has nicks or deformation exceeding 10% of the
lead diameter, width, or thickness
What does it mean when a component has orientation? --- correct
precise answer ---The component must be installed on the board a
specific way. The print/process instructions identify the proper way
to mount the component along with the physical characteristic that
indicates the component orientation (examples: notch, dimple,
wedge).
What does it mean when a component has polarity? --- correct
precise answer ---Components with a specific positive and negative
connection on the board have polarity. Each component has a
specific function, components with polarity must be mounted on the
board correctly
(examples: band, tab, +).
What is the requirement for vertical fill of solder on PWB plated
through holes? --- correct precise answer ---The requirement for
VERTICAL FILL OF SOLDER on a FWB PLATED THROUGH HOLE IS
75% TOTAL FILL. The 25% unfilled height includes depressions on
the top and bottom of the board.
What are some examples of Foreign Object Debris (FOD) that could
be found within an assembly? ( an all above answer) --- correct
precise answer ---(but are not limited to):
, - dirt
- lint
- solder splashes
- solder dross (debris from solder)
- wire clippings
- flux residue
- solder balls that could be dislodged in the normal service
environment (become loose)
Foreign Object Elimination (FOE) --- correct precise answer ---IS A
PLANNED EFFORT TO ELIMINATE FOREIGN OBJECTS, & prevent
migration of foreign objects into FOD sensitive hardware and
processes
- Avoid touching the board surface with bare hands or fingers
- Boards should be handled by the edges
- Check process instructions for glove/finger cot requirements
before handling boards & assemblies. When gloves/finger cots are
used, change as frequently as necessary to prevent cross
contamination.
What is measling? --- correct precise answer ---Measling appears
on the board surface as discrete white spots or "crosses" below the
surface of the base material.
