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IPC-A-610 - Chapter 7 Study Guide with Complete Solutions

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IPC-A-610 - Chapter 7 Study Guide with Complete Solutions Through-Hole Technology - Answer-- The placement of any component on the electronic assembly does not prevent the insertion or removal of any hardware (tool clearance included) used to mount the assembly - Bonding material is sufficient to hold the part but does not encapsulate and cover component identification Connection Mounting - Orientation - Answer-Inspection usually starts with a general overall view of the electronic assembly, then follows each component/wire to its connection, concentrating on the lead into the connection, the connection and the tail end of the lead/wire leaving the connection. The wire/lead protrusion step for all lands should be saved for last so that the board can be flipped over and all connections checked together. *Component Mounting - Orientation - Horizontal Target - Class 1,2,3 - Answer-Nonpolarized components are oriented so that markings are read the same way (left-to-right or top-to-bottom) Component Mounting - Orientation - Vertical GRACEAMELIA 2024/2025 ACADEMIC YEAR ©2024. ALL RIGHTS RESERVED. FIRST PUBLISH OCTOBER, 2024 Page 2/19 Acceptable - Class 1,2,3 - Answer-- Polarized part is mounted with a long ground lead - Nonpolarized component markings read from bottom to top Component Mounting - Lead Forming Defect - Class 1,2,3 - Answer-Lead is kinked Component Mounting - Lead Forming - Space between Seal/Weld and Bend Acceptable - Class 1,2,3 - Answer-Leads of through-hole mounted component extend at least one diameter or thickness but not less than 0.8 mm [0.03 in] from the body, solder bead, or lead weld Component Mounting - Lead Forming - Space between Seal/Weld and Bend Defect - Class 1,2,3 - Answer-Fractured lead weld, solder bead, or component body lead seal Component Mounting - Lead Forming - Stress Relief - Answer-- With camel hump bends. Configuration incorporating a single camel hump may have the body positioned off-center. - Loop bends may be used if the location of the mounting holes prevents the use of a standard bend if there is no possibility of shortening the lead to any adjacent component lead or conductor. Use of loop bends may impact circuit impedance, etc., and shall be approved by design engineering Component Mounting - Lead Forming - Stress Relief GRACEAMELIA 2024/2025 ACADEMIC YEAR ©2024. ALL RIGHTS RESERVED. FIRST PUBLISH OCTOBER, 2024 Page 3/19 Acceptable - Class 1,2,3 - Answer-- Component lead exiting component body is approximately parallel to major body axis - Component centering may be offset as a result of the type of stress relief bond Component Mounting - Lead Forming - Stress Relief Acceptable - Class 1 Process Indicator - Class 2 Defect - Class 3 - Answer-Lead bends less than one diameter or thickness but less than 0.8mm [0.03 in] away from body seal Component Mounting - Lead Forming - Damage Acceptable - Class 1,2,3 - Answer-No nicks or deformation exceeding 10% of the diameter, width or thickness of the lead Component Mounting - Lead Forming - Damage Defect - Class 1,2,3 - Answer-Heavy indentations such as serrated pliers mark Component Mounting - Leads Crossing Conductors Acceptable - Class 1,2,3 - Answer-- Sleeve does not interfere with formation of the required solder connection - Sleeve covers area of protection designated GRACEAMELIA 2024/2025 ACADEMIC YEAR ©2024. ALL RIGHTS RESERVED. FIRST PUBLISH OCTOBER, 2024 Page 4/19 Component Mounting - Leads Crossing Conductors Not Established - Class 1 Defect - Class 2,3 - Answer-Splitting and/or unraveling of sleeving Component Mounting - Leads Crossing Conductors Defect - Class 2,3 - Answer-A component lead crossing an electrically noncommon conductor violates minimum electrical clearance Component Mounting - Hole Obstruction Process Indicator - Class 2 Defect - Class 3 - Answer-Parts and components obstruct solder flow onto the primary side (solder destination side) lands of plated through-holes required to be soldered Component Mounting - DIP/SIP Devices and Sockets Acceptable - Class 1,2,3 - Answer-Amount of tilt is limited by m

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GRACEAMELIA 2024/2025 ACADEMIC YEAR ©2024. ALL RIGHTS
RESERVED. FIRST PUBLISH OCTOBER, 2024



IPC-A-610 - Chapter 7 Study Guide with
Complete Solutions

Through-Hole Technology - Answer✔✔-- The placement of any component on the electronic

assembly does not prevent the insertion or removal of any hardware (tool clearance included)

used to mount the assembly


- Bonding material is sufficient to hold the part but does not encapsulate and cover component

identification


Connection Mounting - Orientation - Answer✔✔-Inspection usually starts with a general overall

view of the electronic assembly, then follows each component/wire to its connection,

concentrating on the lead into the connection, the connection and the tail end of the lead/wire

leaving the connection. The wire/lead protrusion step for all lands should be saved for last so

that the board can be flipped over and all connections checked together.


*Component Mounting - Orientation - Horizontal


Target - Class 1,2,3 - Answer✔✔-Nonpolarized components are oriented so that markings are

read the same way (left-to-right or top-to-bottom)


Component Mounting - Orientation - Vertical


Page 1/19

,GRACEAMELIA 2024/2025 ACADEMIC YEAR ©2024. ALL RIGHTS
RESERVED. FIRST PUBLISH OCTOBER, 2024

Acceptable - Class 1,2,3 - Answer✔✔-- Polarized part is mounted with a long ground lead


- Nonpolarized component markings read from bottom to top


Component Mounting - Lead Forming


Defect - Class 1,2,3 - Answer✔✔-Lead is kinked


Component Mounting - Lead Forming - Space between Seal/Weld and Bend


Acceptable - Class 1,2,3 - Answer✔✔-Leads of through-hole mounted component extend at

least one diameter or thickness but not less than 0.8 mm [0.03 in] from the body, solder bead,

or lead weld


Component Mounting - Lead Forming - Space between Seal/Weld and Bend


Defect - Class 1,2,3 - Answer✔✔-Fractured lead weld, solder bead, or component body lead seal


Component Mounting - Lead Forming - Stress Relief - Answer✔✔-- With camel hump bends.

Configuration incorporating a single camel hump may have the body positioned off-center.


- Loop bends may be used if the location of the mounting holes prevents the use of a standard

bend if there is no possibility of shortening the lead to any adjacent component lead or

conductor. Use of loop bends may impact circuit impedance, etc., and shall be approved by

design engineering


Component Mounting - Lead Forming - Stress Relief



Page 2/19

, GRACEAMELIA 2024/2025 ACADEMIC YEAR ©2024. ALL RIGHTS
RESERVED. FIRST PUBLISH OCTOBER, 2024

Acceptable - Class 1,2,3 - Answer✔✔-- Component lead exiting component body is

approximately parallel to major body axis


- Component centering may be offset as a result of the type of stress relief bond


Component Mounting - Lead Forming - Stress Relief


Acceptable - Class 1


Process Indicator - Class 2


Defect - Class 3 - Answer✔✔-Lead bends less than one diameter or thickness but less than

0.8mm [0.03 in] away from body seal


Component Mounting - Lead Forming - Damage


Acceptable - Class 1,2,3 - Answer✔✔-No nicks or deformation exceeding 10% of the diameter,

width or thickness of the lead


Component Mounting - Lead Forming - Damage


Defect - Class 1,2,3 - Answer✔✔-Heavy indentations such as serrated pliers mark


Component Mounting - Leads Crossing Conductors


Acceptable - Class 1,2,3 - Answer✔✔-- Sleeve does not interfere with formation of the required

solder connection


- Sleeve covers area of protection designated

Page 3/19

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