IPC A 610 UPDATED EXAM SCRIPT QUESTIONS AND
ANSWERS RATED A+
✔✔Is disposition of individual process indicators required? - ✔✔No, and affected
products should be used as-is.
✔✔Conditions Not Specified - ✔✔A condition that is neither a defect, nor a process
indicator. A condition not specified may be considered acceptable unless it can be
established that the condition affects user-defined form, fit or function.
✔✔Primary Side - ✔✔The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
✔✔The Primary Side is also known as... - ✔✔the component side, or the solder
destination side (in through-hole mounting technology).
✔✔Solder source side - ✔✔The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
✔✔Solder Destination Side - ✔✔The side of the PCB that the solder flows toward in
through-hole technology. The destination is is normally the primary side of the PCB, but
might be the secondary side in some cases.
✔✔Cold Solder Connection - ✔✔A solder connection that exhibits poor wetting and that
is characterized by a grayish porous appearance.
✔✔What can cause a cold solder connection? - ✔✔Excessive impurities in the solder,
inadequate cleaning prior to the soldering, and/or insufficient application of heat during
the soldering process.
✔✔Any violation of minimal electrical clearance is a... - ✔✔defect condition for all
classes.
✔✔Meniscus (component) - ✔✔Sealant or encapsulant on a lead, protruding from the
seating plane of the component. This includes ceramic, epoxy or other composites, and
flash from molded components.
✔✔Nonfunctional Land - ✔✔A land that is not connected electrically to the conductive
pattern on its layer.
✔✔Wire OverWRAP - ✔✔A wire/lead that is wrapped more than 360 degrees and
remains in contact with the terminal post.
, ✔✔Wire OverLAP - ✔✔A wire/lead is wrapped more than 360 degrees and crosses
over itself (and does not remain in contact with the terminal post).
✔✔Examples and illustrations... - ✔✔are often grossly exaggerated in order to depict
the reasons for this classification.
✔✔Inspection Methodology - ✔✔The inspector does not select the class for the
assembly under inspection.
✔✔Verification of Dimensions - ✔✔The actual measurements provided in this document
(i.e., specific part mountings and solder fillet dimensions and determination of
percentages) are not required except for referee purposes.
✔✔The tolerance for magnification aides is... - ✔✔+/- 15% of the selected magnification
power.
✔✔Illumination at the surface of workstations should be at least _ - ✔✔1000lm/m2
[approximately 93 foot candles].
✔✔Light sources should be selected to prevent _. - ✔✔shadows
✔✔IPC-T-50 - ✔✔Terms and definitions for interconnecting and packaging electronic
circuits.
✔✔Electrostatic Discharge (ESD) - ✔✔The rapid transfer of static electric charge from
one object to another of a different potential that was created from electrostatic sources.
✔✔Electrical Overstress (EOS) - ✔✔The internal result of an unwanted application of
electrical energy that results in damaged components.
✔✔Describe the ESD susceptibility symbol. - ✔✔A triangle with a reaching hand and a
slash across both.
✔✔Static Sheilding Packaging - ✔✔Prevents an electrostatic discharge from passing
through the package and into the assembly causing damage.
✔✔Antistatic (low charging) packaging materials - ✔✔Used to provide inexpensive
cushioning and intermediate packaging for ESD sensitive (ESDS) items.
✔✔Are eating, drinking or use of tobacco products in the work area permitted? - ✔✔No.
✔✔Should work areas be kept clean and neat? - ✔✔Yes.
ANSWERS RATED A+
✔✔Is disposition of individual process indicators required? - ✔✔No, and affected
products should be used as-is.
✔✔Conditions Not Specified - ✔✔A condition that is neither a defect, nor a process
indicator. A condition not specified may be considered acceptable unless it can be
established that the condition affects user-defined form, fit or function.
✔✔Primary Side - ✔✔The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
✔✔The Primary Side is also known as... - ✔✔the component side, or the solder
destination side (in through-hole mounting technology).
✔✔Solder source side - ✔✔The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
✔✔Solder Destination Side - ✔✔The side of the PCB that the solder flows toward in
through-hole technology. The destination is is normally the primary side of the PCB, but
might be the secondary side in some cases.
✔✔Cold Solder Connection - ✔✔A solder connection that exhibits poor wetting and that
is characterized by a grayish porous appearance.
✔✔What can cause a cold solder connection? - ✔✔Excessive impurities in the solder,
inadequate cleaning prior to the soldering, and/or insufficient application of heat during
the soldering process.
✔✔Any violation of minimal electrical clearance is a... - ✔✔defect condition for all
classes.
✔✔Meniscus (component) - ✔✔Sealant or encapsulant on a lead, protruding from the
seating plane of the component. This includes ceramic, epoxy or other composites, and
flash from molded components.
✔✔Nonfunctional Land - ✔✔A land that is not connected electrically to the conductive
pattern on its layer.
✔✔Wire OverWRAP - ✔✔A wire/lead that is wrapped more than 360 degrees and
remains in contact with the terminal post.
, ✔✔Wire OverLAP - ✔✔A wire/lead is wrapped more than 360 degrees and crosses
over itself (and does not remain in contact with the terminal post).
✔✔Examples and illustrations... - ✔✔are often grossly exaggerated in order to depict
the reasons for this classification.
✔✔Inspection Methodology - ✔✔The inspector does not select the class for the
assembly under inspection.
✔✔Verification of Dimensions - ✔✔The actual measurements provided in this document
(i.e., specific part mountings and solder fillet dimensions and determination of
percentages) are not required except for referee purposes.
✔✔The tolerance for magnification aides is... - ✔✔+/- 15% of the selected magnification
power.
✔✔Illumination at the surface of workstations should be at least _ - ✔✔1000lm/m2
[approximately 93 foot candles].
✔✔Light sources should be selected to prevent _. - ✔✔shadows
✔✔IPC-T-50 - ✔✔Terms and definitions for interconnecting and packaging electronic
circuits.
✔✔Electrostatic Discharge (ESD) - ✔✔The rapid transfer of static electric charge from
one object to another of a different potential that was created from electrostatic sources.
✔✔Electrical Overstress (EOS) - ✔✔The internal result of an unwanted application of
electrical energy that results in damaged components.
✔✔Describe the ESD susceptibility symbol. - ✔✔A triangle with a reaching hand and a
slash across both.
✔✔Static Sheilding Packaging - ✔✔Prevents an electrostatic discharge from passing
through the package and into the assembly causing damage.
✔✔Antistatic (low charging) packaging materials - ✔✔Used to provide inexpensive
cushioning and intermediate packaging for ESD sensitive (ESDS) items.
✔✔Are eating, drinking or use of tobacco products in the work area permitted? - ✔✔No.
✔✔Should work areas be kept clean and neat? - ✔✔Yes.
