IPC CID+ Certification Exam 2025 | Complete
Questions and Correct Answers (Verified
Answers) | Just Released
When blind and buried vias are prepared prior to lamination, they should be
considered as what kind of feature? ---------CORRECT ANSWER-----------------
Through-hole plate feature
When blind and buried vias are prepared after lamination, the drilling step
required what? ---------CORRECT ANSWER-----------------Controlled depth
Drill goes down only to the layers that are to be connected and does not pierce
conductors or violate minimum clearance ---------CORRECT ANSWER-----------------
Controlled depth
Blind structure (as plated) with a maximum aspect ratio of 1:! terminating on or
penetrating a target land with a total length of no more than 0.25mm measured
from the structure's capture land foil to the target land ---------CORRECT ANSWER-
----------------Microvia
When utilizing a microvia structure, thinner dielectric material will contribute to
what? ---------CORRECT ANSWER-----------------Higher reliability
,What is the most difficult part of the fabrication process? ---------CORRECT
ANSWER-----------------Plating down into a via
What feature of a PCB is affected b a stackup? ---------CORRECT ANSWER-------------
----Circuit density, balanced construction, pin escape & routability, signal return
path & minimizing parasitic cross-talk, lamination, drill, and via plating process,
dielectric material properties, and thickness, impedance requirements, overall
board thickness, metal thickness and surface finish, annular ring and drill size &
hole producing process
What is good practice to add in the manufacturing drilling process? ---------
CORRECT ANSWER-----------------Create a separate drill file for each drill layer set
In regards to the reliability of a plated through hole, the stress is on what and
affects what? ---------CORRECT ANSWER-----------------Stress is on the expansion in
the Z-axis, affects the strain in the barrel
Ratio of the thickness of a PCB compared to the diameter of the smallest hold
drilled in the PCB ---------CORRECT ANSWER-----------------Aspect Ratio
, What is the fastest dielectric constant and what is it? ---------CORRECT ANSWER----
-------------Air, Dk=1
High resistance to the flow of direct current and can be polarized by an electrical
field ---------CORRECT ANSWER-----------------Dielectric material
Permittivity; ratio of capacitance of electrodes with a specific material as the
dielectric between them to the capacitance of that same configuration ---------
CORRECT ANSWER-----------------Dielectric constant
As digital application have higher operating frequencies and signal switching gets
faster, how do dielectric properties affect these signals? ---------CORRECT
ANSWER-----------------Results in short rise and fall times
For high frequency, what dielectric parameters would you want and why is it
important? ---------CORRECT ANSWER-----------------Lower dielectric constants and
dissipation factor are important in providing: faster conductor signal speed,
shorter propagation delay times, lower dielectric loses, wider interconnects for
the same design impedance
What happens when Tg increases? ---------CORRECT ANSWER-----------------Z-axis
expansion places a greater stress on the barrel
Questions and Correct Answers (Verified
Answers) | Just Released
When blind and buried vias are prepared prior to lamination, they should be
considered as what kind of feature? ---------CORRECT ANSWER-----------------
Through-hole plate feature
When blind and buried vias are prepared after lamination, the drilling step
required what? ---------CORRECT ANSWER-----------------Controlled depth
Drill goes down only to the layers that are to be connected and does not pierce
conductors or violate minimum clearance ---------CORRECT ANSWER-----------------
Controlled depth
Blind structure (as plated) with a maximum aspect ratio of 1:! terminating on or
penetrating a target land with a total length of no more than 0.25mm measured
from the structure's capture land foil to the target land ---------CORRECT ANSWER-
----------------Microvia
When utilizing a microvia structure, thinner dielectric material will contribute to
what? ---------CORRECT ANSWER-----------------Higher reliability
,What is the most difficult part of the fabrication process? ---------CORRECT
ANSWER-----------------Plating down into a via
What feature of a PCB is affected b a stackup? ---------CORRECT ANSWER-------------
----Circuit density, balanced construction, pin escape & routability, signal return
path & minimizing parasitic cross-talk, lamination, drill, and via plating process,
dielectric material properties, and thickness, impedance requirements, overall
board thickness, metal thickness and surface finish, annular ring and drill size &
hole producing process
What is good practice to add in the manufacturing drilling process? ---------
CORRECT ANSWER-----------------Create a separate drill file for each drill layer set
In regards to the reliability of a plated through hole, the stress is on what and
affects what? ---------CORRECT ANSWER-----------------Stress is on the expansion in
the Z-axis, affects the strain in the barrel
Ratio of the thickness of a PCB compared to the diameter of the smallest hold
drilled in the PCB ---------CORRECT ANSWER-----------------Aspect Ratio
, What is the fastest dielectric constant and what is it? ---------CORRECT ANSWER----
-------------Air, Dk=1
High resistance to the flow of direct current and can be polarized by an electrical
field ---------CORRECT ANSWER-----------------Dielectric material
Permittivity; ratio of capacitance of electrodes with a specific material as the
dielectric between them to the capacitance of that same configuration ---------
CORRECT ANSWER-----------------Dielectric constant
As digital application have higher operating frequencies and signal switching gets
faster, how do dielectric properties affect these signals? ---------CORRECT
ANSWER-----------------Results in short rise and fall times
For high frequency, what dielectric parameters would you want and why is it
important? ---------CORRECT ANSWER-----------------Lower dielectric constants and
dissipation factor are important in providing: faster conductor signal speed,
shorter propagation delay times, lower dielectric loses, wider interconnects for
the same design impedance
What happens when Tg increases? ---------CORRECT ANSWER-----------------Z-axis
expansion places a greater stress on the barrel
