IPC-A-610 Tested Exam Questions With Reviewed 100% Correct
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1. Staking Adhesive - Adhesive material extending from under the component is visible in the
Component Bonding termination area, but end joint width meets minimum requirements
Acceptable - Class 1
Process Indicator -
Class 2
2. Staking Adhesive - Adhesive materials extending from under the component are visible in the
Component Bonding termination area
Defect - Class 3
3. Staking Adhesive - - On round components adhesive adheres to a minimum 25% of the
Mechanical Strength component height
Acceptable - Class - On round components a minimum of three beads of staking material
1,2,3 placed approximately evenly around the periphery of the component
- Slight flow under the component body does not damage the components
or attect form, fit and function
4. Staking Adhesive - On round components there are less than three beads of staking material
Mechanical Strength
Not Established -
Class 1
Defect - Class 2,3
5. Staking Adhesive - Adhesive is not completely cured and homogemous
Mechanical Strength
Defect - Class 1,2,3
6. QUESTION**: SMT Unless otherwise specified, solder shall not touch a package body or seal.
Leads - Plastic Com- Expectations are when a copper lead or termination configuration causes
ponents the solder fillet to contact a plastic component body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
, IPC-A-610 Tested Exam Questions With Reviewed 100% Correct
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7. SMT Leads - Damage Lead is damaged or deformed more than 10% of the diameter, width or
Defect - Class 1,2,3 thickness of the lead
8. SMT Leads - Flatten- The thickness of the flattened lead is less than 40% of the original diameter
ing
Acceptable - Class 1,2
Defect - Class 3
9. SMT Connections - Components with surface and/or termination ends or sides that are not
wettable by design are exempt from solder wetting requirements in those
areas. Solder fillet wetting to the sides or ends of the leads is not required
unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend
under the body or surface mount components whose leads are made of
Alloy 42 or similar metals.
10. SMT Connections Component titled/raised does not attect form, fit or function
Acceptable - Class
1,2,3
11. Chip Components - Side overhang (A) is less than or equal to 50% width of component termi-
Bottom Only Termi- nation area (W) or 50% width of land (P), whichever is less
nations - Side Over-
hang (A)
Acceptable - Class 1,2
12. Chip Components - Side overhang (A) is less than or equal to 25% width of component termi-
Bottom Only Termi- nation area (W) or 25% width of land (P), whichever is less
nations - Side Over-
hang (A)
Acceptable - Class 3
13.
, IPC-A-610 Tested Exam Questions With Reviewed 100% Correct
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Chip Components - Minimum end joint width (C) is 50% width of component termination (W)
Bottom Only Termi- or 50% width of land (P), whichever is less
nations - End Joint
Width (C)
Acceptable - Class 1,2
14. Chip Components - Minimum end joint width (C) is 75% width of component termination (W)
Bottom Only Termi- or 75% width of land (P), whichever is less
nations - End Joint
Width (C)
Acceptable Class 3
15. Chip Components - End overlap (J) between the component termination and the land is mini-
Bottom Only Termi- mum 50% the length of component termination (R)
nations - End Overlap
( J)
Acceptable - Class 2
16. Chip Components - End overlap (J) between the component termination and the land is mini-
Bottom Only Termi- mum 75% the length of component termination (R)
nations - End Over-
lap
Acceptable - Class 3
17. Rectangular or Side overhang (A) is less than or equal to 50% width of component termi-
Square End Clip Com- nation area (W) or 50% width of land (P), whichever is less
ponents - 1,2,3 or 5
Termination(s) - Side
Overhang (A)
Acceptable - Class 1,2
18. Rectangular or Side overhang (A) is less than or equal to 25% width of component termi-
Square End Clip Com- nation area (W) or 25% width of land (P), whichever is less
Detailed Answers Guaranteed Pass!!
1. Staking Adhesive - Adhesive material extending from under the component is visible in the
Component Bonding termination area, but end joint width meets minimum requirements
Acceptable - Class 1
Process Indicator -
Class 2
2. Staking Adhesive - Adhesive materials extending from under the component are visible in the
Component Bonding termination area
Defect - Class 3
3. Staking Adhesive - - On round components adhesive adheres to a minimum 25% of the
Mechanical Strength component height
Acceptable - Class - On round components a minimum of three beads of staking material
1,2,3 placed approximately evenly around the periphery of the component
- Slight flow under the component body does not damage the components
or attect form, fit and function
4. Staking Adhesive - On round components there are less than three beads of staking material
Mechanical Strength
Not Established -
Class 1
Defect - Class 2,3
5. Staking Adhesive - Adhesive is not completely cured and homogemous
Mechanical Strength
Defect - Class 1,2,3
6. QUESTION**: SMT Unless otherwise specified, solder shall not touch a package body or seal.
Leads - Plastic Com- Expectations are when a copper lead or termination configuration causes
ponents the solder fillet to contact a plastic component body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
, IPC-A-610 Tested Exam Questions With Reviewed 100% Correct
Detailed Answers Guaranteed Pass!!
7. SMT Leads - Damage Lead is damaged or deformed more than 10% of the diameter, width or
Defect - Class 1,2,3 thickness of the lead
8. SMT Leads - Flatten- The thickness of the flattened lead is less than 40% of the original diameter
ing
Acceptable - Class 1,2
Defect - Class 3
9. SMT Connections - Components with surface and/or termination ends or sides that are not
wettable by design are exempt from solder wetting requirements in those
areas. Solder fillet wetting to the sides or ends of the leads is not required
unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend
under the body or surface mount components whose leads are made of
Alloy 42 or similar metals.
10. SMT Connections Component titled/raised does not attect form, fit or function
Acceptable - Class
1,2,3
11. Chip Components - Side overhang (A) is less than or equal to 50% width of component termi-
Bottom Only Termi- nation area (W) or 50% width of land (P), whichever is less
nations - Side Over-
hang (A)
Acceptable - Class 1,2
12. Chip Components - Side overhang (A) is less than or equal to 25% width of component termi-
Bottom Only Termi- nation area (W) or 25% width of land (P), whichever is less
nations - Side Over-
hang (A)
Acceptable - Class 3
13.
, IPC-A-610 Tested Exam Questions With Reviewed 100% Correct
Detailed Answers Guaranteed Pass!!
Chip Components - Minimum end joint width (C) is 50% width of component termination (W)
Bottom Only Termi- or 50% width of land (P), whichever is less
nations - End Joint
Width (C)
Acceptable - Class 1,2
14. Chip Components - Minimum end joint width (C) is 75% width of component termination (W)
Bottom Only Termi- or 75% width of land (P), whichever is less
nations - End Joint
Width (C)
Acceptable Class 3
15. Chip Components - End overlap (J) between the component termination and the land is mini-
Bottom Only Termi- mum 50% the length of component termination (R)
nations - End Overlap
( J)
Acceptable - Class 2
16. Chip Components - End overlap (J) between the component termination and the land is mini-
Bottom Only Termi- mum 75% the length of component termination (R)
nations - End Over-
lap
Acceptable - Class 3
17. Rectangular or Side overhang (A) is less than or equal to 50% width of component termi-
Square End Clip Com- nation area (W) or 50% width of land (P), whichever is less
ponents - 1,2,3 or 5
Termination(s) - Side
Overhang (A)
Acceptable - Class 1,2
18. Rectangular or Side overhang (A) is less than or equal to 25% width of component termi-
Square End Clip Com- nation area (W) or 25% width of land (P), whichever is less
