IPC J-STD-001G UPDATED ACTUAL QUESTIONS WITH
CORRECT ANSWERS
Question 1.
Conductor Diameter
ANSWER
the outside diameter of wire,stranded or solid, w/o the insulation
Question 2.
Wire Diameter
ANSWER
the outside diameter of wire, stranded or solid, with insulation if present
Question 3.
Disposition
ANSWER
The determination of how defects should be treated.
Question 4.
Electrical Clearance
ANSWER
The minimum spacing between noncommon uninsulated conductors.
Question 5.
FOD (Foreign Object Debris)
ANSWER
A substance, debris, particulate matter or article alien to the assembly or system.
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, Question 6.
High Voltage
ANSWER
Varies by design and application.
Question 7.
Manufacturer (Assembler)
ANSWER
Individual, organization, or company responsible for the assembly process and verification
operations necessary to ensure full compliance.
Question 8.
Objective Evidence
ANSWER
Documentation in the form of hard copy, computer data, video, that demonstrates the
requirements in the Standard have been met.
Question 9.
Process Control
ANSWER
A system or method to continually steer an operation in reducing variation in the processes.
Question 10.
Proficiency
ANSWER
The capability to perform tasks in accordance with the requirements and verification
procedures.
Question 11.
Solder Destination Side
ANSWER
The side of the PCB that the solder flows toward in a plated through-hole application.
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CORRECT ANSWERS
Question 1.
Conductor Diameter
ANSWER
the outside diameter of wire,stranded or solid, w/o the insulation
Question 2.
Wire Diameter
ANSWER
the outside diameter of wire, stranded or solid, with insulation if present
Question 3.
Disposition
ANSWER
The determination of how defects should be treated.
Question 4.
Electrical Clearance
ANSWER
The minimum spacing between noncommon uninsulated conductors.
Question 5.
FOD (Foreign Object Debris)
ANSWER
A substance, debris, particulate matter or article alien to the assembly or system.
1/9
, Question 6.
High Voltage
ANSWER
Varies by design and application.
Question 7.
Manufacturer (Assembler)
ANSWER
Individual, organization, or company responsible for the assembly process and verification
operations necessary to ensure full compliance.
Question 8.
Objective Evidence
ANSWER
Documentation in the form of hard copy, computer data, video, that demonstrates the
requirements in the Standard have been met.
Question 9.
Process Control
ANSWER
A system or method to continually steer an operation in reducing variation in the processes.
Question 10.
Proficiency
ANSWER
The capability to perform tasks in accordance with the requirements and verification
procedures.
Question 11.
Solder Destination Side
ANSWER
The side of the PCB that the solder flows toward in a plated through-hole application.
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