MSE 200 Exam 1 Study Guide with Complete
Solutions
Materials Science Engineering - ANS-the discipline of studying the relationships
between structures and their properties
Metals - ANS-metallic bonding; high thermal and electrical conductivity; strong
Polymers - ANS-covalent bonding; low strength; thermal and electrical insulators
Ceramics - ANS-ionic bonding; non-conducting; brittle/glassy
4 characteristics of MSE - ANS-properties, structures, performance, and processing
5 main properties - ANS-optical, thermal, electrical, magnetic, and deteriorative
Ground State vs. Excited State - ANS-lowest energy level vs. atoms are energized
Electronic Structure - ANS-n (1,2,3,...), l (n-1), m_l (-l to +l), m_s (-1/2 or 1/2)
Pauli Exclusion Principle - ANS-electrons must spin in opposite directions
Bonding Properties - ANS-melting temperature is larger if bond energy is larger;
elastic modulus is larger if bond energy is larger, coefficient of thermal expansion is
larger if bond energy is smaller
Simple Cubic Structure - ANS-low packing density (.52)
coordination #: 6
number of atoms: 1
lattice constant a = 2r
Body Centered Structure - ANS-low packing density (.68)
coordination #: 8
number of atoms: 2
lattice constant a = 4r/sqrt(3)
Face Centered Structure - ANS-low packing density (.74)
coordination #: 12
number of atoms: 4
lattice constant a = 4r/sqrt(2)
Hexagonal Close Packed Structure - ANS-Same as FCC except number of atoms is 6
Theoretical Density - ANS-Density = nA/vN
Solutions
Materials Science Engineering - ANS-the discipline of studying the relationships
between structures and their properties
Metals - ANS-metallic bonding; high thermal and electrical conductivity; strong
Polymers - ANS-covalent bonding; low strength; thermal and electrical insulators
Ceramics - ANS-ionic bonding; non-conducting; brittle/glassy
4 characteristics of MSE - ANS-properties, structures, performance, and processing
5 main properties - ANS-optical, thermal, electrical, magnetic, and deteriorative
Ground State vs. Excited State - ANS-lowest energy level vs. atoms are energized
Electronic Structure - ANS-n (1,2,3,...), l (n-1), m_l (-l to +l), m_s (-1/2 or 1/2)
Pauli Exclusion Principle - ANS-electrons must spin in opposite directions
Bonding Properties - ANS-melting temperature is larger if bond energy is larger;
elastic modulus is larger if bond energy is larger, coefficient of thermal expansion is
larger if bond energy is smaller
Simple Cubic Structure - ANS-low packing density (.52)
coordination #: 6
number of atoms: 1
lattice constant a = 2r
Body Centered Structure - ANS-low packing density (.68)
coordination #: 8
number of atoms: 2
lattice constant a = 4r/sqrt(3)
Face Centered Structure - ANS-low packing density (.74)
coordination #: 12
number of atoms: 4
lattice constant a = 4r/sqrt(2)
Hexagonal Close Packed Structure - ANS-Same as FCC except number of atoms is 6
Theoretical Density - ANS-Density = nA/vN