IPC A 610 REVISION TIPS QUESTIONS AND ANSWERS
RATED A+
✔✔Component Securing - Mounting Clips
Defect - Class 1,2,3 - ✔✔Clip does not restrain component
✔✔Component Securing - Adhesive Bonding - ✔✔- The criteria below shall be used
when staking is required and criteria are not provided on the drawing. These criteria do
not apply to SMT components.
- Visual inspection of staking may be performed without magnification. Magnification
from 1.75X to 4X may be used for referee purposes.
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Acceptable - Class 1,2,3 - ✔✔On a horizontally mounted component the staking
material:
- Adheres to component for at least 50% of it's length (L)
- Minimum fillet height of 25% of the component diameter (D)
On a vertically mounted component:
- The staking material bead(s) are continuous for at least 25% of the component length
(L) (height) with slight flow of staking material under the component body with contact to
the component body seal
- The staking material adheres to the component:
-- For at least three beads spaced approximately evenly around the circumference
adding to minimum 25%
OR
-- A single bead for a minimum of at least 25% of the component circumference
Multiple vertically mounted components:
- Staking material adheres to each component for at least 25% of its length (L), and the
adhesion is continuous between components
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1,2
Defect - Class 3 - ✔✔On a vertically mounted component (sleeved or unsleeved) the
staking material is less than 25% of the component's diameter (D) on both sides
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1
Defect - Class 2,3 - ✔✔Horizontally mounted axial leaded components having staking
material contacting component body seals
Vertically mounted component:
- Adhesive is less than 25% of the component length (height)
, ✔✔Component Securing - Adhesive Bonding - Elevated Components
Acceptable - Class 1,2,3 - ✔✔- In at least four places evenly spaced
- At least 20% of the total periphery of the component is bonded
- Adhesive material does not interfere with formation of required solder connection
✔✔Component Securing - Adhesive Bonding - Elevated Components
Defect - Class 1,2,3 - ✔✔- Bonding requirements are less than specified requirements
- The bonding material forms too thin a column to provide good support
✔✔Supported Holes - Axial Leaded - Horizontal
Process Indicator - Class 3 - ✔✔The farthest distance (D) between the component body
and the board is larger than 0.7 mm [0.03 in]
✔✔Supported Holes - Axial Leaded - Horizontal
Defect - Class 1,2,3 - ✔✔-Component height exceeds user-determined dimension (H)
- Components required to be mounted above the board surface are less than 1.5 mm
[0.06 in] (C) from the board surface
✔✔Supported Holes - Axial Leaded - Vertical
Acceptable - Class 1,2,3 - ✔✔- The component or welded bead clearance (C) above the
land meets the requirements of Table 7-2
- The angle of the component lead does not cause a violation of minimum electrical
clearance
✔✔Supported Holes - Axial Leaded - Vertical
Defect - Class 1,2,3 - ✔✔Component height does not meet form, fit or function
✔✔Supported Holes - Wire/Lead Protrusion
Defect - Class 1,2,3 - ✔✔- Lead protrusion violates minimum electrical clearance
- Lead protrusion exceeds maximum design height requirements
✔✔Supported Holes - Wire/Lead Clinches - ✔✔This section applies to terminations with
a clinching requirement. Other requirements may be specified on relevant specifications
or drawings. Partially clinched leads for part retention are considered as unclenched
leads and shall meet protrusion requirements.
✔✔Supported Holes - Wire/Lead Clinches
Defect - Class 1,2,3 - ✔✔The lead is clinched toward an electrically noncommon
conductor and violates minimum electrical clearance (C)
✔✔Supported Holes - Solder
Acceptable - Class 1,2,3 - ✔✔Lead is discernible in the solder
RATED A+
✔✔Component Securing - Mounting Clips
Defect - Class 1,2,3 - ✔✔Clip does not restrain component
✔✔Component Securing - Adhesive Bonding - ✔✔- The criteria below shall be used
when staking is required and criteria are not provided on the drawing. These criteria do
not apply to SMT components.
- Visual inspection of staking may be performed without magnification. Magnification
from 1.75X to 4X may be used for referee purposes.
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Acceptable - Class 1,2,3 - ✔✔On a horizontally mounted component the staking
material:
- Adheres to component for at least 50% of it's length (L)
- Minimum fillet height of 25% of the component diameter (D)
On a vertically mounted component:
- The staking material bead(s) are continuous for at least 25% of the component length
(L) (height) with slight flow of staking material under the component body with contact to
the component body seal
- The staking material adheres to the component:
-- For at least three beads spaced approximately evenly around the circumference
adding to minimum 25%
OR
-- A single bead for a minimum of at least 25% of the component circumference
Multiple vertically mounted components:
- Staking material adheres to each component for at least 25% of its length (L), and the
adhesion is continuous between components
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1,2
Defect - Class 3 - ✔✔On a vertically mounted component (sleeved or unsleeved) the
staking material is less than 25% of the component's diameter (D) on both sides
✔✔Component Securing - Adhesive Bonding - Nonelevated Components
Not Established - Class 1
Defect - Class 2,3 - ✔✔Horizontally mounted axial leaded components having staking
material contacting component body seals
Vertically mounted component:
- Adhesive is less than 25% of the component length (height)
, ✔✔Component Securing - Adhesive Bonding - Elevated Components
Acceptable - Class 1,2,3 - ✔✔- In at least four places evenly spaced
- At least 20% of the total periphery of the component is bonded
- Adhesive material does not interfere with formation of required solder connection
✔✔Component Securing - Adhesive Bonding - Elevated Components
Defect - Class 1,2,3 - ✔✔- Bonding requirements are less than specified requirements
- The bonding material forms too thin a column to provide good support
✔✔Supported Holes - Axial Leaded - Horizontal
Process Indicator - Class 3 - ✔✔The farthest distance (D) between the component body
and the board is larger than 0.7 mm [0.03 in]
✔✔Supported Holes - Axial Leaded - Horizontal
Defect - Class 1,2,3 - ✔✔-Component height exceeds user-determined dimension (H)
- Components required to be mounted above the board surface are less than 1.5 mm
[0.06 in] (C) from the board surface
✔✔Supported Holes - Axial Leaded - Vertical
Acceptable - Class 1,2,3 - ✔✔- The component or welded bead clearance (C) above the
land meets the requirements of Table 7-2
- The angle of the component lead does not cause a violation of minimum electrical
clearance
✔✔Supported Holes - Axial Leaded - Vertical
Defect - Class 1,2,3 - ✔✔Component height does not meet form, fit or function
✔✔Supported Holes - Wire/Lead Protrusion
Defect - Class 1,2,3 - ✔✔- Lead protrusion violates minimum electrical clearance
- Lead protrusion exceeds maximum design height requirements
✔✔Supported Holes - Wire/Lead Clinches - ✔✔This section applies to terminations with
a clinching requirement. Other requirements may be specified on relevant specifications
or drawings. Partially clinched leads for part retention are considered as unclenched
leads and shall meet protrusion requirements.
✔✔Supported Holes - Wire/Lead Clinches
Defect - Class 1,2,3 - ✔✔The lead is clinched toward an electrically noncommon
conductor and violates minimum electrical clearance (C)
✔✔Supported Holes - Solder
Acceptable - Class 1,2,3 - ✔✔Lead is discernible in the solder
