RESERVED. FIRST PUBLISH OCTOBER, 2024
IPC-A-610 - Chapter 7 Study Guide with
Complete Solutions
Through-Hole Technology - Answer✔✔-- The placement of any component on the electronic
assembly does not prevent the insertion or removal of any hardware (tool clearance included)
used to mount the assembly
- Bonding material is sufficient to hold the part but does not encapsulate and cover component
identification
Connection Mounting - Orientation - Answer✔✔-Inspection usually starts with a general overall
view of the electronic assembly, then follows each component/wire to its connection,
concentrating on the lead into the connection, the connection and the tail end of the lead/wire
leaving the connection. The wire/lead protrusion step for all lands should be saved for last so
that the board can be flipped over and all connections checked together.
*Component Mounting - Orientation - Horizontal
Target - Class 1,2,3 - Answer✔✔-Nonpolarized components are oriented so that markings are
read the same way (left-to-right or top-to-bottom)
Component Mounting - Orientation - Vertical
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RESERVED. FIRST PUBLISH OCTOBER, 2024
Acceptable - Class 1,2,3 - Answer✔✔-- Polarized part is mounted with a long ground lead
- Nonpolarized component markings read from bottom to top
Component Mounting - Lead Forming
Defect - Class 1,2,3 - Answer✔✔-Lead is kinked
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Acceptable - Class 1,2,3 - Answer✔✔-Leads of through-hole mounted component extend at
least one diameter or thickness but not less than 0.8 mm [0.03 in] from the body, solder bead,
or lead weld
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Defect - Class 1,2,3 - Answer✔✔-Fractured lead weld, solder bead, or component body lead seal
Component Mounting - Lead Forming - Stress Relief - Answer✔✔-- With camel hump bends.
Configuration incorporating a single camel hump may have the body positioned off-center.
- Loop bends may be used if the location of the mounting holes prevents the use of a standard
bend if there is no possibility of shortening the lead to any adjacent component lead or
conductor. Use of loop bends may impact circuit impedance, etc., and shall be approved by
design engineering
Component Mounting - Lead Forming - Stress Relief
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RESERVED. FIRST PUBLISH OCTOBER, 2024
Acceptable - Class 1,2,3 - Answer✔✔-- Component lead exiting component body is
approximately parallel to major body axis
- Component centering may be offset as a result of the type of stress relief bond
Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1
Process Indicator - Class 2
Defect - Class 3 - Answer✔✔-Lead bends less than one diameter or thickness but less than
0.8mm [0.03 in] away from body seal
Component Mounting - Lead Forming - Damage
Acceptable - Class 1,2,3 - Answer✔✔-No nicks or deformation exceeding 10% of the diameter,
width or thickness of the lead
Component Mounting - Lead Forming - Damage
Defect - Class 1,2,3 - Answer✔✔-Heavy indentations such as serrated pliers mark
Component Mounting - Leads Crossing Conductors
Acceptable - Class 1,2,3 - Answer✔✔-- Sleeve does not interfere with formation of the required
solder connection
- Sleeve covers area of protection designated
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