IPC-A-610 | Chapter 8 Exam Questions
& Answers (Grade A+)
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 -
correct answer ✅Adhesive material extending from under the
component is visible in the termination area, but end joint width
meets minimum requirements
Staking Adhesive - Component Bonding
Defect - Class 3 -
correct answer ✅Adhesive materials extending from under the
component are visible in the termination area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 -
correct answer ✅- On round components adhesive adheres to a
minimum 25% of the component height
- On round components a minimum of three beads of staking
material placed approximately evenly around the periphery of the
component
- Slight flow under the component body does not damage the
components or affect form, fit and function
,IPC-A-610 | Chapter 8 Exam Questions
& Answers (Grade A+)
Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 -
correct answer ✅On round components there are less than three
beads of staking material
Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3 -
correct answer ✅Adhesive is not completely cured and
homogemous
QUESTION**: SMT Leads - Plastic Components -
correct answer ✅Unless otherwise specified, solder shall not
touch a package body or seal. Expectations are when a copper lead
or termination configuration causes the solder fillet to contact a
plastic component body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
, IPC-A-610 | Chapter 8 Exam Questions
& Answers (Grade A+)
Defect - Class 1,2,3 -
correct answer ✅Lead is damaged or deformed more than 10% of
the diameter, width or thickness of the lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 -
correct answer ✅The thickness of the flattened lead is less than
40% of the original diameter
SMT Connections -
correct answer ✅- Components with surface and/or termination
ends or sides that are not wettable by design are exempt from
solder wetting requirements in those areas. Solder fillet wetting to
the sides or ends of the leads is not required unless specifically
stated.
- Solder fillet may extend through the top bend. Solder should not
extend under the body or surface mount components whose leads
are made of Alloy 42 or similar metals.
SMT Connections
& Answers (Grade A+)
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 -
correct answer ✅Adhesive material extending from under the
component is visible in the termination area, but end joint width
meets minimum requirements
Staking Adhesive - Component Bonding
Defect - Class 3 -
correct answer ✅Adhesive materials extending from under the
component are visible in the termination area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 -
correct answer ✅- On round components adhesive adheres to a
minimum 25% of the component height
- On round components a minimum of three beads of staking
material placed approximately evenly around the periphery of the
component
- Slight flow under the component body does not damage the
components or affect form, fit and function
,IPC-A-610 | Chapter 8 Exam Questions
& Answers (Grade A+)
Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 -
correct answer ✅On round components there are less than three
beads of staking material
Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3 -
correct answer ✅Adhesive is not completely cured and
homogemous
QUESTION**: SMT Leads - Plastic Components -
correct answer ✅Unless otherwise specified, solder shall not
touch a package body or seal. Expectations are when a copper lead
or termination configuration causes the solder fillet to contact a
plastic component body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
, IPC-A-610 | Chapter 8 Exam Questions
& Answers (Grade A+)
Defect - Class 1,2,3 -
correct answer ✅Lead is damaged or deformed more than 10% of
the diameter, width or thickness of the lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 -
correct answer ✅The thickness of the flattened lead is less than
40% of the original diameter
SMT Connections -
correct answer ✅- Components with surface and/or termination
ends or sides that are not wettable by design are exempt from
solder wetting requirements in those areas. Solder fillet wetting to
the sides or ends of the leads is not required unless specifically
stated.
- Solder fillet may extend through the top bend. Solder should not
extend under the body or surface mount components whose leads
are made of Alloy 42 or similar metals.
SMT Connections
