IPC A 610 Exam Questions and Answers | Latest
2026/2027 Update (100% Correct)
Order of Precedence in event of conflict 1 - ANSWER -1. Procurement as agreed and
documented between customer and supplier.
Order of Precedence in event of conflict 2 - ANSWER -Master drawing or master ass.
drawing reflecting the customer's detailed requirements.
Order of Precedence in event of conflict 3 - ANSWER -IPC-1-610 when invoked by the
customer or contract.
Acceptable Condition - ANSWER -A condition that, while not necessarily perfect, will
maintain integrity and reliability of the assembly
Defect Condition - ANSWER -The form, fit or function of the assembly is inadequate for
use in its end use environment.
Disposition - ANSWER -The determination of how defects should be treated. These
include rework, use as is, scrap, and repair.
Who dispositions defect conditions? - ANSWER -The manufacturer, based on design,
service and customer requirements.
Process Indicator Conditions - ANSWER -A condition (not a defect) that does not affect
the form, fit or function of a product.
Process indicators should be... - ANSWER -monitored as part of the process control
system
Is disposition of individual process indicators required? - ANSWER -No, and affected
products should be used as-is.
, The Primary Side is also known as... - ANSWER -the component side, or the solder
destination side (in through-hole mounting technology).
Solder source side - ANSWER -The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
Solder Destination Side - ANSWER -The side of the PCB that the solder flows toward
in through-hole technology. The destination is is normally the primary side of the PCB,
but might be the secondary side in some cases.
A defect for Class 1... - ANSWER -automatically implies a defect for Class 2 and 3. A
defect for Class 2 implies a defect for Class 3.
If documents other than IPC-A-610 are cited, the order of precedence shall be defined
in the _ - ANSWER -Procurement documents
Target Condition - ANSWER -A condition that is close to perfect, but is not always
achievable and may not be necessary to ensure the reliability of the assembly.
Conditions Not Specified - ANSWER -A condition that is neither a defect, nor a process
indicator. A condition not specified may be considered acceptable unless it can be
established that the condition affects user-defined form, fit or function.
Primary Side - ANSWER -The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
Cold Solder Connection - ANSWER -A solder connection that exhibits poor wetting and
that is characterized by a grayish porous appearance.
What can cause a cold solder connection? - ANSWER -Excessive impurities in the
solder, inadequate cleaning prior to the soldering, and/or insufficient application of heat
during the soldering process.
2026/2027 Update (100% Correct)
Order of Precedence in event of conflict 1 - ANSWER -1. Procurement as agreed and
documented between customer and supplier.
Order of Precedence in event of conflict 2 - ANSWER -Master drawing or master ass.
drawing reflecting the customer's detailed requirements.
Order of Precedence in event of conflict 3 - ANSWER -IPC-1-610 when invoked by the
customer or contract.
Acceptable Condition - ANSWER -A condition that, while not necessarily perfect, will
maintain integrity and reliability of the assembly
Defect Condition - ANSWER -The form, fit or function of the assembly is inadequate for
use in its end use environment.
Disposition - ANSWER -The determination of how defects should be treated. These
include rework, use as is, scrap, and repair.
Who dispositions defect conditions? - ANSWER -The manufacturer, based on design,
service and customer requirements.
Process Indicator Conditions - ANSWER -A condition (not a defect) that does not affect
the form, fit or function of a product.
Process indicators should be... - ANSWER -monitored as part of the process control
system
Is disposition of individual process indicators required? - ANSWER -No, and affected
products should be used as-is.
, The Primary Side is also known as... - ANSWER -the component side, or the solder
destination side (in through-hole mounting technology).
Solder source side - ANSWER -The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
Solder Destination Side - ANSWER -The side of the PCB that the solder flows toward
in through-hole technology. The destination is is normally the primary side of the PCB,
but might be the secondary side in some cases.
A defect for Class 1... - ANSWER -automatically implies a defect for Class 2 and 3. A
defect for Class 2 implies a defect for Class 3.
If documents other than IPC-A-610 are cited, the order of precedence shall be defined
in the _ - ANSWER -Procurement documents
Target Condition - ANSWER -A condition that is close to perfect, but is not always
achievable and may not be necessary to ensure the reliability of the assembly.
Conditions Not Specified - ANSWER -A condition that is neither a defect, nor a process
indicator. A condition not specified may be considered acceptable unless it can be
established that the condition affects user-defined form, fit or function.
Primary Side - ANSWER -The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
Cold Solder Connection - ANSWER -A solder connection that exhibits poor wetting and
that is characterized by a grayish porous appearance.
What can cause a cold solder connection? - ANSWER -Excessive impurities in the
solder, inadequate cleaning prior to the soldering, and/or insufficient application of heat
during the soldering process.
