RATED A+
✔✔Conductor Overlap - ✔✔When a conductor is wrapped more than 360* and crosses
over itself (does not remain in contact with the post)
✔✔Conductor Overwrap - ✔✔When a conductor is wrapped more than 360* and
remains in contact with the post
✔✔Conductor Diameter - ✔✔The outside diameter of wire WITHOUT the insulation
✔✔Wire Diameter - ✔✔The outside diameter of wire INCLUDING insulation
✔✔Strand Diameter - ✔✔The outside diameter of the individual metal filament used
within a stranded wire
✔✔Minimum Electrical Clearance - ✔✔The designed minimum spacing between non
common uninsulated conductors (may include leads, terminals, wires, fasteners,
hardware)
✔✔Engineering Documents - ✔✔Drawings, specifications, technical illustrations and
other documents, prepared and released by the design activity, that establish the design
and design requirements
✔✔FOD (Foreign Object Debris) - ✔✔Substance, debris, particulate matter or article
alien to the assembly or system
✔✔Form, Fit, Function (F/F/F) - ✔✔An identifying characteristic (part, solder connection,
sub assembly, assembly) that, if not met, would adversely impact installation, reliability,
or operation of adjacent parts, a next level assembly or integrated assembly or system
✔✔High Voltage - ✔✔Varies by design and application. Only applicable when
specifically required in the drawings/procurement documentation (user defined)
✔✔Intrusive Solder - ✔✔A process in which solder paste for the through-hole
terminations is applied using a stencil or syringe (pin-in-paste, reflow oven)
✔✔Kink - ✔✔Tight or abrupt bend in a wire/lead that visibly reduces the
diameter/thickness of the conductor and cannot be removed by straightening
✔✔Locking Mechanism - ✔✔Device or method for preventing the loosening or
disconnection of a mated part (ex VGA screws)