IPC J-STD-001J (Section 4) Exam with precise ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
detailed solutions ||//\\||
At the start of soldering operations, component leads and wire conductors to be soldered
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
shall x1x2x3 meet the solderability requirements of [what]. Sect 4.1
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
D1D2D3 J-STD-002 ||//\\||
At the start of soldering operations, printed circuit boards shall x1x2x3 meet the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
requirements of [what]. Sect 4.1 ||//\\|| ||//\\|| ||//\\|| ||//\\||
D1D2D3 J-STD-003 ||//\\||
Gold removal is performed to reduce the risk of what? Sect 4.3.1
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Risk of failure associated with embrittled solder.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Gold embrittlement shall x1x2x3 be considered a defect. Sect 4.3.1
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
N1D2D3
Gold shall x1x2x3 be removed from all solder cup terminals regardless of gold thickness. Sect
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
4.3.1
||//\\||
N1D2D3
What processes may be used for gold removal prior to installing a component in an
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
assembly? Sect 4.3.1 ||//\\|| ||//\\||
Double tinting process or dynamic solder wave. ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Gold removal is not required when: Sect 4.3.3 ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
There is documented objective evidence available for review or electroless nickel/immersion
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
gold ENIG finish. ||//\\|| ||//\\||
Thermally sensitive components shall x1x2x3 have protective measures taken to prevent ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
overheating. Sect 4.4 ||//\\|| ||//\\||
D1D2D3
If a solder iron tip makes direct contact with the end termination of a sensitive component
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
(i.e. ceramic cap), the component shall x1x2x3 be [what]? Sect 4.4.2
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
, D1D2D3 Replaced ||//\\||
When sleeving is required as protection for glass components that will be encapsulated or
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
staked, the sleeving shall x1x2x3 be placed... Sect 4.7
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
... D1D2D3 on the component prior to installation.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Uninsulated parts installed over exposed circuitry shall x1x2x3 have their leads formed to ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
provide a minimum of what distance between the bottom of the component body and
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
exposed circuitry? Sect 4.7 ||//\\|| ||//\\|| ||//\\||
N1N2D3 0.25mm [0.010in] ||//\\|| ||//\\||
Unless otherwise defined, the requirements for part installation apply to both what and
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
what? Sect 4.7.1 ||//\\|| ||//\\||
Wires and component leads
||//\\|| ||//\\|| ||//\\||
Leads shall not x1x2x3 have nicks or deformation exceeding what percentage of the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
diameter? Sect 4.7.2 ||//\\|| ||//\\||
D1D2D3 10% ||//\\||
Parts shall x1x2x3 be installed such that they do not obstruct solder flow onto the solder
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
destination side. Sect 4.8 ||//\\|| ||//\\|| ||//\\||
A1P2D3
Metal-cased components shall x1x2x3 be isolated from adjacent electrically conductive ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
elements. Sect 4.9 ||//\\|| ||//\\||
D1D2D3
Adhesive materials shall not x1x2x3 preclude the formation of an acceptable solder
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
connection. Sect 4.10 ||//\\|| ||//\\||
D1D2D3
Adhesive materials extending from under SMT components shall not x1x2x3 be visible in the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
solder connection. Sect 4.10||//\\|| ||//\\|| ||//\\||
A1P2D3
Staking shall not x1x2x3 contact an unsleeved area of a sleeved glass body component. Sect
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
4.10
D1D2D3
detailed solutions ||//\\||
At the start of soldering operations, component leads and wire conductors to be soldered
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
shall x1x2x3 meet the solderability requirements of [what]. Sect 4.1
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
D1D2D3 J-STD-002 ||//\\||
At the start of soldering operations, printed circuit boards shall x1x2x3 meet the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
requirements of [what]. Sect 4.1 ||//\\|| ||//\\|| ||//\\|| ||//\\||
D1D2D3 J-STD-003 ||//\\||
Gold removal is performed to reduce the risk of what? Sect 4.3.1
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Risk of failure associated with embrittled solder.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Gold embrittlement shall x1x2x3 be considered a defect. Sect 4.3.1
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
N1D2D3
Gold shall x1x2x3 be removed from all solder cup terminals regardless of gold thickness. Sect
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
4.3.1
||//\\||
N1D2D3
What processes may be used for gold removal prior to installing a component in an
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
assembly? Sect 4.3.1 ||//\\|| ||//\\||
Double tinting process or dynamic solder wave. ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Gold removal is not required when: Sect 4.3.3 ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
There is documented objective evidence available for review or electroless nickel/immersion
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
gold ENIG finish. ||//\\|| ||//\\||
Thermally sensitive components shall x1x2x3 have protective measures taken to prevent ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
overheating. Sect 4.4 ||//\\|| ||//\\||
D1D2D3
If a solder iron tip makes direct contact with the end termination of a sensitive component
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
(i.e. ceramic cap), the component shall x1x2x3 be [what]? Sect 4.4.2
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
, D1D2D3 Replaced ||//\\||
When sleeving is required as protection for glass components that will be encapsulated or
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
staked, the sleeving shall x1x2x3 be placed... Sect 4.7
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
... D1D2D3 on the component prior to installation.
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
Uninsulated parts installed over exposed circuitry shall x1x2x3 have their leads formed to ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
provide a minimum of what distance between the bottom of the component body and
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
exposed circuitry? Sect 4.7 ||//\\|| ||//\\|| ||//\\||
N1N2D3 0.25mm [0.010in] ||//\\|| ||//\\||
Unless otherwise defined, the requirements for part installation apply to both what and
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
what? Sect 4.7.1 ||//\\|| ||//\\||
Wires and component leads
||//\\|| ||//\\|| ||//\\||
Leads shall not x1x2x3 have nicks or deformation exceeding what percentage of the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
diameter? Sect 4.7.2 ||//\\|| ||//\\||
D1D2D3 10% ||//\\||
Parts shall x1x2x3 be installed such that they do not obstruct solder flow onto the solder
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
destination side. Sect 4.8 ||//\\|| ||//\\|| ||//\\||
A1P2D3
Metal-cased components shall x1x2x3 be isolated from adjacent electrically conductive ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
elements. Sect 4.9 ||//\\|| ||//\\||
D1D2D3
Adhesive materials shall not x1x2x3 preclude the formation of an acceptable solder
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
connection. Sect 4.10 ||//\\|| ||//\\||
D1D2D3
Adhesive materials extending from under SMT components shall not x1x2x3 be visible in the
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
solder connection. Sect 4.10||//\\|| ||//\\|| ||//\\||
A1P2D3
Staking shall not x1x2x3 contact an unsleeved area of a sleeved glass body component. Sect
||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\|| ||//\\||
4.10
D1D2D3
