IPC J-STD-001G
EXPECTED QUESTIONS WITH VERIFIED ANSWERS
Question 1.
the outside diameter w/o the insulation
ANSWER
of wire,stranded or solid, Conductor Diameter
Question 2.
the outside diameter with insulation if present
ANSWER
of wire, stranded or solid, Wire Diameter
Question 3.
The determination ed.
ANSWER
of how defects should be treat- Disposition
Question 4.
The minimum spacing uninsulated conductors.
ANSWER
between noncommon Electrical Clearance
Question 5.
A substance, debris, alien to the assembly
ANSWER
particulate matter or article FOD (Foreign Object Debris) or system.
Question 6.
Varies by design and
ANSWER
application. High Voltage
1/8
, Question 7.
Individual, organization, for the assembly process tions necessary to
ANSWER
or company responsible Manufacturer (Assembler) and verification opera- ensure full
compliance.
Question 8.
Documentation in puter data, video, ments in the Standard
ANSWER
the form of hard copy, com- Objective Evidence that demonstrates the require- have been
met.
Question 9.
A system or method ation in reducing
ANSWER
to continually steer an oper- Process Control variation in the processes.
Question 10.
The capability to perform the requirements
ANSWER
tasks in accordance with Proficiency and verification procedures.
Question 11.
The side of the PCB a plated through-hole
ANSWER
that the solder flows toward in Solder Destination Side application.
Question 12.
The side of the PCB
ANSWER
to which solder is applied. Solder Source Side
2/8
EXPECTED QUESTIONS WITH VERIFIED ANSWERS
Question 1.
the outside diameter w/o the insulation
ANSWER
of wire,stranded or solid, Conductor Diameter
Question 2.
the outside diameter with insulation if present
ANSWER
of wire, stranded or solid, Wire Diameter
Question 3.
The determination ed.
ANSWER
of how defects should be treat- Disposition
Question 4.
The minimum spacing uninsulated conductors.
ANSWER
between noncommon Electrical Clearance
Question 5.
A substance, debris, alien to the assembly
ANSWER
particulate matter or article FOD (Foreign Object Debris) or system.
Question 6.
Varies by design and
ANSWER
application. High Voltage
1/8
, Question 7.
Individual, organization, for the assembly process tions necessary to
ANSWER
or company responsible Manufacturer (Assembler) and verification opera- ensure full
compliance.
Question 8.
Documentation in puter data, video, ments in the Standard
ANSWER
the form of hard copy, com- Objective Evidence that demonstrates the require- have been
met.
Question 9.
A system or method ation in reducing
ANSWER
to continually steer an oper- Process Control variation in the processes.
Question 10.
The capability to perform the requirements
ANSWER
tasks in accordance with Proficiency and verification procedures.
Question 11.
The side of the PCB a plated through-hole
ANSWER
that the solder flows toward in Solder Destination Side application.
Question 12.
The side of the PCB
ANSWER
to which solder is applied. Solder Source Side
2/8
