ATMAE CERTIFICATION EVALUATION TEST
PAPER QUESTIONS AND SOLUTIONS
VERIFIED COMPLETE
●● Melting temperature of the filler metals
Answer: The essential difference between brazing and soldering is the:
●● 0.001 - 0.006 of an inch / 0.025 - 0.15 of a millimeter
Answer: Joint clearances for both brazing and soldering commonly
range from:
●● Wetting
Answer: Another term for capillary action is:
●● Dip brazing
Answer: A brazing process that does not use torches, brazing furnaces or
electric
coils is:
●● Lack of mechanical strength
Answer: A limitation of the soldering process is:
, ●● Thermoplastics
Answer: Soldering is not used to join:
●● Exposing only a small area of the board to the solder at any one time
Answer: In wave soldering excess heat and distortion of the PCB's is
avoided by:
●● 840 °F (450°C).
Answer: Soldering is done with fillers that melt at below _________ .
●● deformation and diffusion
Answer: Solid-state processes use ______________________to join
materials without molten and re-solidified material in the final bond
area.
●● joint design
Answer: Weld process applicability is most dependent upon:
●● becomes part of the weld
Answer: A consumable electrode is one which:
●● under a blanket of granular flux
Answer: Submerged arc welding takes place:
PAPER QUESTIONS AND SOLUTIONS
VERIFIED COMPLETE
●● Melting temperature of the filler metals
Answer: The essential difference between brazing and soldering is the:
●● 0.001 - 0.006 of an inch / 0.025 - 0.15 of a millimeter
Answer: Joint clearances for both brazing and soldering commonly
range from:
●● Wetting
Answer: Another term for capillary action is:
●● Dip brazing
Answer: A brazing process that does not use torches, brazing furnaces or
electric
coils is:
●● Lack of mechanical strength
Answer: A limitation of the soldering process is:
, ●● Thermoplastics
Answer: Soldering is not used to join:
●● Exposing only a small area of the board to the solder at any one time
Answer: In wave soldering excess heat and distortion of the PCB's is
avoided by:
●● 840 °F (450°C).
Answer: Soldering is done with fillers that melt at below _________ .
●● deformation and diffusion
Answer: Solid-state processes use ______________________to join
materials without molten and re-solidified material in the final bond
area.
●● joint design
Answer: Weld process applicability is most dependent upon:
●● becomes part of the weld
Answer: A consumable electrode is one which:
●● under a blanket of granular flux
Answer: Submerged arc welding takes place:
