IPC CID+ EXAM | MOST RECENT EXAM 2026 ACTUAL
COMLETE REAL EXAM QUESTIONS AND CORRECT
ANSWERS (VERIFIED ANSWERS) ALREADY GRADED
A+ | NEWEST EXAM | JUST RELEASED!!
Thermal energy/heat that is transferred by electro-magnetic
radiation primarily
in the infrared (IR) wave length - ANSWER-
Radiation
How do large cores/large copper affect the reflow
profile? - ANSWER-
Significant heatsink and impact the reflow of the
solder surfaces
What is highly advisable to do when a board contains a
metal core? -
ANSWER-Add a note on the Assembly
Drawing
Why does 0402 equate to 0.03936~" x 0.01968~" not
0.04"x0.02"? - ANSWER-
Inaccurate round
offs
,What are the 3 vantage points of dimensioning? - ANSWER-
Mechanical
Constraints Drawing (mating the PCB with the mechanical
housing), PCB Master Drawing, QA inspection criteria (ensure
conformance of manufactured product for intended usage)
For the relationship of the PCB to the Mechanical Constraints
drawing, what is
critical to do to alleviate problems related to tolerance
stackup? - ANSWER-
Using similar origins and coordinates, 0/0 origin (non-
plated tooling hole)
Unusual shaped boards are placed in an assembly array
to do what? -
ANSWER-Maximize material usage and to facilitate
board/array handling
The first two tooling features form the basis for what? The third
tooling features
is a method for what? - ANSWER-Dimensioning system;
determining any
angular movement of a
material
Slots with a pin to allow for movement about the center
without stressing any
materials - ANSWER-Tooling
features
, Pros and cons of buried and blind vias? - ANSWER-Cons:
Add additional
processing steps in
manufacturing
Pros: Provide additional real estate for placement
and routing
How does the sequential lamination of preparing blind and
buried vias affect the
PCB? - ANSWER-Addition in plating
thickness
When blind and buried vias are prepared prior to lamination,
they should be
considered as what kind of feature? - ANSWER-Through-
hole plate feature
When blind and buried vias are prepared after lamination,
the drilling step
required what? - ANSWER-
Controlled depth
Drill goes down only to the layers that are to be connected and
does not pierce
conductors or violate minimum clearance - ANSWER-
Controlled depth
COMLETE REAL EXAM QUESTIONS AND CORRECT
ANSWERS (VERIFIED ANSWERS) ALREADY GRADED
A+ | NEWEST EXAM | JUST RELEASED!!
Thermal energy/heat that is transferred by electro-magnetic
radiation primarily
in the infrared (IR) wave length - ANSWER-
Radiation
How do large cores/large copper affect the reflow
profile? - ANSWER-
Significant heatsink and impact the reflow of the
solder surfaces
What is highly advisable to do when a board contains a
metal core? -
ANSWER-Add a note on the Assembly
Drawing
Why does 0402 equate to 0.03936~" x 0.01968~" not
0.04"x0.02"? - ANSWER-
Inaccurate round
offs
,What are the 3 vantage points of dimensioning? - ANSWER-
Mechanical
Constraints Drawing (mating the PCB with the mechanical
housing), PCB Master Drawing, QA inspection criteria (ensure
conformance of manufactured product for intended usage)
For the relationship of the PCB to the Mechanical Constraints
drawing, what is
critical to do to alleviate problems related to tolerance
stackup? - ANSWER-
Using similar origins and coordinates, 0/0 origin (non-
plated tooling hole)
Unusual shaped boards are placed in an assembly array
to do what? -
ANSWER-Maximize material usage and to facilitate
board/array handling
The first two tooling features form the basis for what? The third
tooling features
is a method for what? - ANSWER-Dimensioning system;
determining any
angular movement of a
material
Slots with a pin to allow for movement about the center
without stressing any
materials - ANSWER-Tooling
features
, Pros and cons of buried and blind vias? - ANSWER-Cons:
Add additional
processing steps in
manufacturing
Pros: Provide additional real estate for placement
and routing
How does the sequential lamination of preparing blind and
buried vias affect the
PCB? - ANSWER-Addition in plating
thickness
When blind and buried vias are prepared prior to lamination,
they should be
considered as what kind of feature? - ANSWER-Through-
hole plate feature
When blind and buried vias are prepared after lamination,
the drilling step
required what? - ANSWER-
Controlled depth
Drill goes down only to the layers that are to be connected and
does not pierce
conductors or violate minimum clearance - ANSWER-
Controlled depth
