IPC J-STD-001J (SECTION 4)
QUESTIONS WITH GUARANTEED
ACCURATE ANSWERS |PASS!!
At the start of soldering operations, component leads and wire conductors to be
soldered shall x1x2x3 meet the solderability requirements of [what]. Sect 4.1 -
ACCURATE ANSWERS✔✔ D1D2D3 J-STD-002
At the start of soldering operations, printed circuit boards shall x1x2x3 meet the
requirements of [what]. Sect 4.1 - ACCURATE ANSWERS✔✔ D1D2D3 J-STD-
003
Gold removal is performed to reduce the risk of what? Sect 4.3.1 - ACCURATE
ANSWERS✔✔ Risk of failure associated with embrittled solder.
Gold embrittlement shall x1x2x3 be considered a defect. Sect 4.3.1 - ACCURATE
ANSWERS✔✔ N1D2D3
Gold shall x1x2x3 be removed from all solder cup terminals regardless of gold
thickness. Sect 4.3.1 - ACCURATE ANSWERS✔✔ N1D2D3
What processes may be used for gold removal prior to installing a component in an
assembly? Sect 4.3.1 - ACCURATE ANSWERS✔✔ Double tinting process or
dynamic solder wave.
, Gold removal is not required when: Sect 4.3.3 - ACCURATE ANSWERS✔✔
There is documented objective evidence available for review or electroless
nickel/immersion gold ENIG finish.
Thermally sensitive components shall x1x2x3 have protective measures taken to
prevent overheating. Sect 4.4 - ACCURATE ANSWERS✔✔ D1D2D3
If a solder iron tip makes direct contact with the end termination of a sensitive
component (i.e. ceramic cap), the component shall x1x2x3 be [what]? Sect 4.4.2 -
ACCURATE ANSWERS✔✔ D1D2D3 Replaced
When sleeving is required as protection for glass components that will be
encapsulated or staked, the sleeving shall x1x2x3 be placed... Sect 4.7 -
ACCURATE ANSWERS✔✔ ... D1D2D3 on the component prior to installation.
Uninsulated parts installed over exposed circuitry shall x1x2x3 have their leads
formed to provide a minimum of what distance between the bottom of the
component body and exposed circuitry? Sect 4.7 - ACCURATE ANSWERS✔✔
N1N2D3 0.25mm [0.010in]
Unless otherwise defined, the requirements for part installation apply to both what
and what? Sect 4.7.1 - ACCURATE ANSWERS✔✔ Wires and component leads
Leads shall not x1x2x3 have nicks or deformation exceeding what percentage of
the diameter? Sect 4.7.2 - ACCURATE ANSWERS✔✔ D1D2D3 10%
Parts shall x1x2x3 be installed such that they do not obstruct solder flow onto the
solder destination side. Sect 4.8 - ACCURATE ANSWERS✔✔ A1P2D3
QUESTIONS WITH GUARANTEED
ACCURATE ANSWERS |PASS!!
At the start of soldering operations, component leads and wire conductors to be
soldered shall x1x2x3 meet the solderability requirements of [what]. Sect 4.1 -
ACCURATE ANSWERS✔✔ D1D2D3 J-STD-002
At the start of soldering operations, printed circuit boards shall x1x2x3 meet the
requirements of [what]. Sect 4.1 - ACCURATE ANSWERS✔✔ D1D2D3 J-STD-
003
Gold removal is performed to reduce the risk of what? Sect 4.3.1 - ACCURATE
ANSWERS✔✔ Risk of failure associated with embrittled solder.
Gold embrittlement shall x1x2x3 be considered a defect. Sect 4.3.1 - ACCURATE
ANSWERS✔✔ N1D2D3
Gold shall x1x2x3 be removed from all solder cup terminals regardless of gold
thickness. Sect 4.3.1 - ACCURATE ANSWERS✔✔ N1D2D3
What processes may be used for gold removal prior to installing a component in an
assembly? Sect 4.3.1 - ACCURATE ANSWERS✔✔ Double tinting process or
dynamic solder wave.
, Gold removal is not required when: Sect 4.3.3 - ACCURATE ANSWERS✔✔
There is documented objective evidence available for review or electroless
nickel/immersion gold ENIG finish.
Thermally sensitive components shall x1x2x3 have protective measures taken to
prevent overheating. Sect 4.4 - ACCURATE ANSWERS✔✔ D1D2D3
If a solder iron tip makes direct contact with the end termination of a sensitive
component (i.e. ceramic cap), the component shall x1x2x3 be [what]? Sect 4.4.2 -
ACCURATE ANSWERS✔✔ D1D2D3 Replaced
When sleeving is required as protection for glass components that will be
encapsulated or staked, the sleeving shall x1x2x3 be placed... Sect 4.7 -
ACCURATE ANSWERS✔✔ ... D1D2D3 on the component prior to installation.
Uninsulated parts installed over exposed circuitry shall x1x2x3 have their leads
formed to provide a minimum of what distance between the bottom of the
component body and exposed circuitry? Sect 4.7 - ACCURATE ANSWERS✔✔
N1N2D3 0.25mm [0.010in]
Unless otherwise defined, the requirements for part installation apply to both what
and what? Sect 4.7.1 - ACCURATE ANSWERS✔✔ Wires and component leads
Leads shall not x1x2x3 have nicks or deformation exceeding what percentage of
the diameter? Sect 4.7.2 - ACCURATE ANSWERS✔✔ D1D2D3 10%
Parts shall x1x2x3 be installed such that they do not obstruct solder flow onto the
solder destination side. Sect 4.8 - ACCURATE ANSWERS✔✔ A1P2D3
