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IPC CID / COMPLETE EXAM WITH DETAILED QUESTIONS AND ANSWERS / GRADED A+

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IPC CID / COMPLETE EXAM WITH DETAILED QUESTIONS AND ANSWERS / GRADED A+

Institution
ELECTRICAL ENGINEERING.
Course
ELECTRICAL ENGINEERING.










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Written for

Institution
ELECTRICAL ENGINEERING.
Course
ELECTRICAL ENGINEERING.

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Uploaded on
June 17, 2025
Number of pages
20
Written in
2024/2025
Type
Exam (elaborations)
Contains
Questions & answers

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IPC CID / COMPLETE EXAM WITH
DETAILED QUESTIONS AND
ANSWERS / GRADED A+



 What do performance classes reflect?
Progressive increases in sophistication, functional performance, and
frequency/intensity of inspection or stress testing
 What are the three performance classes?
1-General Electronics 2-Dedicated Service 3-High reliability
 Who is the end user?
The end user is the individual or agency that contracts the printed board
or assembly to be designed and manufactured
 Who determines the class of a product?
The end user
 What would be in class 3 performance?
Military, medical, etc.
 What is ambient temperature?
The surrounding environment that comes into contact with your product
 What do producibility levels tell us?
Increasing complexity of tooling, materials, and processing. Yields
increase as costs decrease, etc.
 What increases with each producibility level?
Sophisitication
 What is the zaxis aspect ratio?
Ratio between the nominal thickness of the board and the smallest drill
size.
 What is the most important special consideration in terms of
electrical functionality that a designer must consult the EE?
Special keep out or keep in areas of the board.

, Where should high frequency circuits be placed?
NEar the connector
 Where should filtering caps be placed?
Near the source of power/gnd (at the connector)
 What is least important to route in analog circuits?
Power and ground
 What is a major consideration for component placement?
Will backwards compatibility be necessary?
 What is Ohm's law?
V=IR
 What is an important basic rule for a designer of a board?
Terminate unused logic pins with a pull-down or pull-up resistor.
 What product safety testing regards flame retardants?
UL 94
 How thick is half ounce copper?
0.7 mils (17 um thick)
 What is the subtractive process?
Unwanted copper is etched away
 What is the additive process?
Only wanted copper is added to the board
 What must happen immediately after drilling the holes in the
boards?
Hole deburring
 What is an unsupported hole?
A hole in the printed board that does not contain plating or other
conductive reinforcement
 What is a supported hole?
A hole that has the inside surfaces plated or otherwise reinforced
 What is a buried via?
A via that extends only between conductive layers with no exposure to
the outside world
 How do you measure annular ring on an external layer?
Including the plating the hole.
 How do you measure annular ring on an internal layer?
Excluding the plating in the hole.
 What are minimum annular ring requirements defined by?
Internal supported, external supported and external unsupported holes.
 What is the most important factor in determining the minimum land
size for a hole?
The max drill hole diameter
 What are each of the following: a+2(b+c)+d

, Min land size=max drill hole+2(min annular
ring+etchback)+manufacturing
 What is tolerance?
The amount of variation allowed in a dimension or location
 What is breakout?
Drilled hole breaking out of the edge of the copper land
 What is breakout acceptability?
Varies among class, where different amounts of breakout are allowed.
 What is the MMC and LMC?
Can have dimensions given in a range, where MMC is most material
condition and LMC is least material condition
 What is the recommended electrical spacing from board edge?
16 mils PLUS the electrical requirement
 What is it called when a land is only present to balance the
construction of the board?
Nonfunctional lands
 What is the clearance on nonfunctional lands?
0.25 mm (10 mils)
 What is thermal relief?
Thermal relief is intended to remove sufficient copper to avoid
heatsinking during the soldering processes while still meeting minimum
current carrying requirements
 How do you calculate thermal web size?
0.6(1/number of webs)landsize
What does CTE stand for and what are its units?
Coefficient of thermal expansion and ppm/C
 What is the CTE for copper, brass and aluminum?
Copper: 17-18 ppm/C; brass: 19 ppm/C; aluminum: 24 ppm/C
 What is special about thermal vias?
They must be connected to board-level planes
 What does MTBF mean?
Mean time between failures; a higher mean time means your board is
more reliable
 What is the difference between burn-in testing and HAST?
HAST is usually destructive while burn-in is non-destructive and works to
find infant mortality issues
 What is a test coupon?
Companies find them beneficial and incorporate them into board
production panels to not waste a good board in production
 What is true of test probes?
They must make contact with every net, and can be ensured with the
supplied net-list
R264,87
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